Intel is expanding its efforts in advanced process technology. Recently, Intel revealed intentions to purchase not one, but two High-NA EUV lithography machines from ASML—a significant increase from its initial plan. This move highlights Intel's thorough preparations for the upcoming 14A process, underscoring the allocation of even more resources to this pivotal stage.

ASML's High-NA EUV lithography is often touted as the "Holy Grail" of chip manufacturing, not just due to its hefty $370 million price tag per machine, but also for its groundbreaking advancements in resolution and imaging quality. This High-NA equipment allows for a smaller process feature size compared to traditional low-NA EUV, providing a critical foundation for semiconductor processes progressing towards 2nm nodes and beyond. TSMC, Samsung, SK Hynix, and Intel are among the major customers, with each investment running into hundreds of millions of dollars.

Intel regards the 14A node as a critical juncture for its success. As outlined in their roadmap, 14A will be the initial full-scale implementation of high-NA EUV technology. Should this node fail to gain widespread adoption, Intel might have to relinquish its competitive edge in high-end processes. Therefore, 14A has been positioned as a central strategic element within Intel Foundry Services (IFS), serving as a critical assessment of Intel's ambitious advanced manufacturing objectives. Industry experts suggest that Intel's expenditure on lithography equipment alone may range from $1 billion to $2 billion, reflecting the company's devotion to the success of 14A.

Recent shifts in equipment distribution corroborate this trend. Data indicate that the global order volume for CY27E high-NA EUV lithography machines has increased from 8 to 10, with Intel's order rising from 1 to 2 units, alongside additional orders from Samsung and SK Hynix. For low-NA EUV, Intel is also upping its production capacity, expanding from 3 units to 5. These strategic acquisitions clearly demonstrate Intel's effort to match the lithography capabilities of TSMC and Samsung, laying the groundwork for mass production of the 14A node.

Samsung anticipates commercializing its first high-NA EUV by the end of 2025; TSMC plans a more gradual deployment. Intel aims to secure an early lead in the advanced-node competition by scaling high-NA technology with the 14A process. However, this path is fraught with challenges: previous setbacks in 10nm and 7nm processes have weakened Intel's dominance in the advanced process sector. Now, the successful deployment of 14A is regarded as an essential step to restore confidence.

With the U.S. pushing for enhanced local chip manufacturing, Intel's strategy at advanced nodes like 14A impacts not just its survival but also the United States' standing in the global semiconductor supply chain. Mastering the 18A and transitioning efficiently to 14A will crucially influence the competitiveness of Intel's foundry operations. A successful delivery could see Intel emerge as a key benefactor of high-NA EUV technology; failure might once again diminish its influence in the high-end market. The next couple of years will be pivotal, as developments around the 14A node will serve as an indicator of whether Intel can reassert itself on the cutting edge of manufacturing technology.