MediaTek Dimensity 7025 vs HiSilicon Kirin 970
We compared two versions of phone SoCs: 8 cores 2500MHz MediaTek Dimensity 7025 vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 7025 's Advantages
Larger memory bandwidth (51.2GB/s vs 29.8GB/s)
Higher Frequency (2500MHz vs 2360MHz)
More modern manufacturing process (6nm vs 10nm)
Released 6 years and 7 months late
Score
Benchmark
AnTuTu 10
MediaTek Dimensity 7025
+39%
495066
HiSilicon Kirin 970
355946
AnTuTu 9
CPU
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
Architecture
4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53
2500 MHz
Frequency
2360 MHz
8
Cores
8
ARMv8.2-A
Instruction set
ARMv8-A
L1 cache
-
L2 cache
2 MB
-
L3 cache
0
6 nm
Process
10 nm
10
Transistor count
5.5
-
TDP
9 W
TSMC
Manufacturing
TSMC
Graphics
IMG BXM-8-256
GPU name
Mali-G72 MP12
950 MHz
GPU frequency
768 MHz
8
Execution units
12
18
Shading units
18
16
Max size
8
-
FLOPS
0.3318 TFLOPS
1.3
Vulkan version
1.3
3.0
OpenCL version
2.0
-
DirectX version
12
Memory
LPDDR5
Memory type
LPDDR4X
3200 MHz
Memory frequency
1866 MHz
4x 16 Bit
Bus
4x 16 Bit
51.2 Gbit/s
Max bandwidth
29.8 Gbit/s
AI
-
-
-
-
-
-
Multimedia (ISP)
Yes
Neural processor (NPU)
Yes
UFS 2.2, UFS 3.1
Storage type
UFS 2.1
2520 x 1080
Max display resolution
3120 x 1440
1x 200MP
Max camera resolution
1x 48MP, 2x 20MP
2K at 30FPS
Video capture
4K at 30FPS
-
2K at 30FPS
Video playback
4K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265, VP8, VP9, VC-1
AIFF, CAF, MP3, MP4, WAV
Audio codecs
32 bit@384 kHz, HD-audio
-
-
-
Connectivity
LTE Cat. 18
4G support
LTE Cat. 18
Yes
5G support
No
Up to 2770 Mbps
Download speed
Up to 1200 Mbps
Up to 1250 Mbps
Upload speed
Up to 150 Mbps
5
Wi-Fi
5
5.3
Bluetooth
4.2
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Apr 2024
Announced
Sep 2017
Mid range
Class
Flagship
-
Model number
Hi3670
