AMD is set to introduce a slew of groundbreaking products at CES 2025, among which are the Ryzen AI MAX 300 series (Strix Halo), the Ryzen AI 300 series (Krackan), the Ryzen 9000HX/X3D series (Fire Range), the Ryzen 9 9900X3D series, the Ryzen Z2 Extreme, the RX 9070 series (RDNA 4), FSR 4.0, and the B850/B840 motherboard chipsets.

The models that have garnered the most attention are the Ryzen 9 9950X3D and the Ryzen 9 9900X3D Divine U. These models promise to deliver a top-tier experience in both gaming and productivity, truly offering the best of both worlds.

In a first look, the GeekBench AI test results for the Ryzen 9 9950X3D have emerged; however, these results should be taken with caution as they are derived from an engineering sample with the identifier "100-000000719-52_Y".

Verified as the Ryzen 9 9950X3D, the test results don't reveal much aside from its impressive 16 cores and 32 threads running at a base frequency of 4.0GHz.

According to the information available, similar to its predecessor the Ryzen 9 7950X3D, the 9950X3D features a dual CCD configuration, with a substantial 64MB 3D cache built atop a single CCD.

In CPU-Z, the L3 cache is reported as 96MB + 32MB. This configuration includes the inherent 32MB L3 cache on one CCD, augmented with a 64MB stacked 3D cache, while the other CCD carries a native 32MB L3 cache.

A CPU-Z screenshot confirms that the Ryzen 9 9950X3D reaches a maximum boost clock of 5.65GHz, remarkably close to the 5.7GHz boost of the Ryzen 9 9950X.

This places significant pressure on Intel, highlighting the strong competitive edge AMD continues to maintain.