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Mobile and Tablet SoC Comparison
HiSilicon Kirin 659 vs MediaTek Dimensity 8300
HiSilicon Kirin 659 vs MediaTek Dimensity 8300
VS
HiSilicon Kirin 659
MediaTek Dimensity 8300
We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 659 vs. 8 cores 3350MHz MediaTek Dimensity 8300 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 8300 Advantages
Higher Frequency (3350MHz vs 2360MHz)
More modern manufacturing process (4nm vs 16nm)
Released 6 years and 10 months late
Score
Benchmark
AnTuTu 10
HiSilicon Kirin 659
103952
MediaTek Dimensity 8300
+1390%
1549153
Geekbench 6 Single Core
HiSilicon Kirin 659
215
MediaTek Dimensity 8300
+600%
1506
Geekbench 6 Multi Core
HiSilicon Kirin 659
810
MediaTek Dimensity 8300
+498%
4844
HiSilicon Kirin 659
VS
MediaTek Dimensity 8300
CPU
4x 2.36 GHz – Cortex-A53
4x 1.7 GHz – Cortex-A53
Architecture
1x 3.35 GHz – Cortex-A715
3x 3.2 GHz – Cortex-A715
4x 2.2 GHz – Cortex-A510
2360 MHz
Frequency
3350 MHz
8
Cores
8
-
L3 cache
0
16 nm
Process
4 nm
4
Transistor count
-
-
Manufacturing
TSMC
Graphics
Mali-T830 MP2
GPU name
Mali-G615 MP6
900 MHz
GPU frequency
1400 MHz
2
Execution units
6
16
Shading units
-
4
Max size
24
0.0576 TFLOPS
FLOPS
-
1.0
Vulkan version
1.3
1.2
OpenCL version
2.0
11
DirectX version
-
Memory
LPDDR3
Memory type
LPDDR5X
933 MHz
Memory frequency
4266 MHz
2x 32 Bit
Bus
4x 16 Bit
-
Max bandwidth
68.2 Gbit/s
AI
No
NPU
MediaTek APU 780
Multimedia (ISP)
No
Neural processor (NPU)
MediaTek APU 780
eMMC 5.1
Storage type
UFS 4.0
1920 x 1200
Max display resolution
2960 x 1440
1x 16MP, 2x 8MP
Max camera resolution
1x 320MP
1K at 60FPS
Video capture
4K at 60FPS
1080p at 60FPS
Video playback
4K at 60FPS
H.264, H.265
Video codecs
H.264, H.265, AV1, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Connectivity
LTE Cat. 7
4G support
-
No
5G support
Yes
Up to 300 Mbps
Download speed
Up to 7900 Mbps
Up to 50 Mbps
Upload speed
Up to 4200 Mbps
4
Wi-Fi
6
4.2
Bluetooth
5.4
GPS, GLONASS, Beidou
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Jan 2017
Announced
Nov 2023
Mid range
Class
Flagship
Hi6250
Model number
-
-
Official page
MediaTek Dimensity 8300
Related SoC Comparison
1
HiSilicon Kirin 659 vs Qualcomm Snapdragon 695
2
HiSilicon Kirin 659 vs MediaTek Helio G88
3
HiSilicon Kirin 659 vs Qualcomm Snapdragon 450
4
HiSilicon Kirin 659 vs MediaTek Dimensity 9200 Plus
5
HiSilicon Kirin 659 vs Qualcomm Snapdragon 665
6
HiSilicon Kirin 659 vs HiSilicon Kirin 710
7
HiSilicon Kirin 659 vs HiSilicon Kirin 9010
8
MediaTek Dimensity 6020 vs HiSilicon Kirin 659
9
HiSilicon Kirin 659 vs Qualcomm Snapdragon 7s Gen 2
10
HiSilicon Kirin 659 vs Google Tensor
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