CPU
GPU
SoC
Router
Categories
Rankings
CPU Rankings
GPU Rankings
SoC Rankings
Router Ranking
English
English
Close menu
Home
CPU
GPU
SoC
Router
Categories
CPU Rankings
GPU Rankings
SoC Rankings
Router Ranking
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
Home
Mobile and Tablet SoC Comparison
HiSilicon Kirin 9000E vs Qualcomm Snapdragon 870
HiSilicon Kirin 9000E vs Qualcomm Snapdragon 870
VS
HiSilicon Kirin 9000E
Qualcomm Snapdragon 870
We compared two versions of phone SoCs: 8 cores 3130MHz HiSilicon Kirin 9000E vs. 8 cores 3200MHz Qualcomm Snapdragon 870 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
HiSilicon Kirin 9000E Advantages
Better graphics card performance FLOPS (2.1373 TFLOPS vs 1.3721 TFLOPS )
More modern manufacturing process (5nm vs 7nm)
Qualcomm Snapdragon 870 Advantages
Higher Frequency (3200MHz vs 3130MHz)
Score
Benchmark
Geekbench 6 Single Core
HiSilicon Kirin 9000E
+2%
1176
Qualcomm Snapdragon 870
1151
Geekbench 6 Multi Core
HiSilicon Kirin 9000E
3255
Qualcomm Snapdragon 870
+2%
3336
FP32 (float)
HiSilicon Kirin 9000E
+55%
2137
Qualcomm Snapdragon 870
1372
HiSilicon Kirin 9000E
VS
Qualcomm Snapdragon 870
CPU
1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
Architecture
1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
3130 MHz
Frequency
3200 MHz
8
Cores
8
ARMv8.2-A
Instruction set
ARMv8.2-A
-
L2 cache
1 MB
-
L3 cache
0
5 nm
Process
7 nm
15.3
Transistor count
10.3
6 W
TDP
6 W
TSMC
Manufacturing
TSMC
Graphics
Mali-G78 MP22
GPU name
Adreno 650
759 MHz
GPU frequency
670 MHz
22
Execution units
2
64
Shading units
512
16
Max size
16
2.1373 TFLOPS
FLOPS
1.3721 TFLOPS
1.3
Vulkan version
1.1
2.0
OpenCL version
2.0
12
DirectX version
12.1
Memory
LPDDR5
Memory type
LPDDR5
2750 MHz
Memory frequency
2750 MHz
4x 16 Bit
Bus
4x 16 Bit
44 Gbit/s
Max bandwidth
44 Gbit/s
Multimedia (ISP)
AI accelerator
Neural processor (NPU)
Hexagon 698
UFS 3.1
Storage type
UFS 3.0, UFS 3.1
3840 x 2160
Max display resolution
3840 x 2160
-
Max camera resolution
1x 200MP, 2x 25MP
4K at 60FPS
Video capture
8K at 30FPS, 4K at 60FPS
4K at 60FPS
Video playback
8K at 30FPS, 4K at 60FPS
H.264, H.265, VP9
Video codecs
H.264, H.265, VP8, VP9
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Balong 5000
Modem
X55
Connectivity
LTE Cat. 24
4G support
LTE Cat. 22
Yes
5G support
Yes
Up to 4600 Mbps
Download speed
Up to 7500 Mbps
Up to 2500 Mbps
Upload speed
Up to 3000 Mbps
6
Wi-Fi
6
5.2
Bluetooth
5.2
GPS, GLONASS, Beidou, Galileo, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Oct 2020
Announced
Jan 2021
Flagship
Class
Flagship
-
Model number
SM8250-AC
HiSilicon Kirin 9000E
Official page
Qualcomm Snapdragon 870
Related SoC Comparison
1
HiSilicon Kirin 9000E vs Samsung Exynos 9810
2
HiSilicon Kirin 9000E vs HiSilicon Kirin 935
3
HiSilicon Kirin 9000E vs HiSilicon Kirin 659
4
HiSilicon Kirin 9000E vs Mediatek Dimensity 9300
5
HiSilicon Kirin 9000E vs MediaTek Helio G81
6
HiSilicon Kirin 9000E vs Qualcomm Snapdragon 665
7
HiSilicon Kirin 9000E vs Samsung Exynos 1330
8
HiSilicon Kirin 9000E vs MediaTek Dimensity 1200
9
HiSilicon Kirin 9000E vs Samsung Exynos 7880
10
HiSilicon Kirin 9000E vs MediaTek Dimensity 6100 Plus
© 2024 - TopCPU.net
Contact Us
Privacy Policy