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Mobile and Tablet SoC Comparison
HiSilicon Kirin 960 vs MediaTek Dimensity 7050
HiSilicon Kirin 960 vs MediaTek Dimensity 7050
VS
HiSilicon Kirin 960
MediaTek Dimensity 7050
We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 960 vs. 8 cores 2600MHz MediaTek Dimensity 7050 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 7050 Advantages
Better graphics card performance FLOPS (0.686 TFLOPS vs 0.2655 TFLOPS )
Higher Frequency (2600MHz vs 2360MHz)
More modern manufacturing process (6nm vs 16nm)
Lower TDP (4W vs 5W)
Released 6 years and 7 months late
Score
Benchmark
AnTuTu 10
HiSilicon Kirin 960
278916
MediaTek Dimensity 7050
+91%
535270
Geekbench 6 Single Core
HiSilicon Kirin 960
408
MediaTek Dimensity 7050
+135%
962
Geekbench 6 Multi Core
HiSilicon Kirin 960
1385
MediaTek Dimensity 7050
+70%
2364
FP32 (float)
HiSilicon Kirin 960
265
MediaTek Dimensity 7050
+158%
686
HiSilicon Kirin 960
VS
MediaTek Dimensity 7050
CPU
4x 2.36 GHz – Cortex-A73
4x 1.84 GHz – Cortex-A53
Architecture
2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
2360 MHz
Frequency
2600 MHz
8
Cores
8
ARMv8-A
Instruction set
ARMv8.2-A
4 MB
L2 cache
-
16 nm
Process
6 nm
4
Transistor count
-
5 W
TDP
4 W
TSMC
Manufacturing
TSMC
Graphics
Mali-G71 MP8
GPU name
Mali-G68 MP4
1037 MHz
GPU frequency
800 MHz
8
Execution units
4
16
Shading units
-
4
Max size
16
0.2655 TFLOPS
FLOPS
0.686 TFLOPS
1.3
Vulkan version
1.3
2.0
OpenCL version
2.0
11.3
DirectX version
-
Memory
LPDDR4
Memory type
LPDDR5
1600 MHz
Memory frequency
3200 MHz
2x 32 Bit
Bus
4x 16 Bit
28.8 Gbit/s
Max bandwidth
-
Multimedia (ISP)
No
Neural processor (NPU)
MediaTek APU 550
eMMC 5.1, UFS 2.1
Storage type
UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1
2560 x 1600
Max display resolution
2520 x 1080
2x 16MP
Max camera resolution
1x 200MP
4K at 30FPS
Video capture
4K at 30FPS
4K at 30FPS
Video playback
4K at 30FPS
H.264, H.265, VP8, VP9
Video codecs
H.264, H.265, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Connectivity
LTE Cat. 12
4G support
LTE Cat. 18
No
5G support
Yes
Up to 600 Mbps
Download speed
Up to 2770 Mbps
Up to 150 Mbps
Upload speed
Up to 1250 Mbps
5
Wi-Fi
6
4.2
Bluetooth
5.2
GPS, GLONASS, Beidou, Galileo
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Oct 2016
Announced
May 2023
Flagship
Class
Mid range
Hi3660
Model number
MT6877 MT6877V/TTZA
-
Official page
MediaTek Dimensity 7050
Related SoC Comparison
1
HiSilicon Kirin 960 vs Unisoc T820
2
HiSilicon Kirin 960 vs MediaTek Dimensity 1000 Plus
3
HiSilicon Kirin 960 vs Apple A18
4
HiSilicon Kirin 960 vs MediaTek Dimensity 800U
5
HiSilicon Kirin 960 vs Apple A17 Pro
6
HiSilicon Kirin 960 vs Qualcomm Snapdragon 7s Gen 2
7
HiSilicon Kirin 960 vs MediaTek Helio G35
8
HiSilicon Kirin 960 vs Apple A10 Fusion
9
HiSilicon Kirin 960 vs MediaTek MT6739
10
HiSilicon Kirin 960 vs Qualcomm Snapdragon 7 Plus Gen 3
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