HiSilicon Kirin 970 vs Qualcomm Snapdragon 765G

VS

HiSilicon Kirin 970

Qualcomm Snapdragon 765G

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2400MHz Qualcomm Snapdragon 765G . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 970 Advantages

Larger memory bandwidth (29.8GB/s vs 17GB/s)

Qualcomm Snapdragon 765G Advantages

Better graphics card performance FLOPS (0.576 TFLOPS vs 0.3318 TFLOPS )

Higher Frequency (2400MHz vs 2360MHz)

More modern manufacturing process (7nm vs 10nm)

Lower TDP (5W vs 9W)

Released 2 years and 3 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970

355946

Qualcomm Snapdragon 765G +9%

390350

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 765G +107%

801

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 765G +35%

1861

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 765G +74%

576

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 765G

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

1x 2.4 GHz – Kryo 475 Prime (Cortex-A76)
1x 2.2 GHz – Kryo 475 Gold (Cortex-A76)
6x 1.8 GHz – Kryo 475 Silver (Cortex-A55)

2360 MHz

Frequency

2400 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8.3-A

2 MB

L2 cache

-

0

L3 cache

-

10 nm

Process

7 nm

5.5

Transistor count

-

9 W

TDP

5 W

TSMC

Manufacturing

Samsung

Graphics

Mali-G72 MP12

GPU name

Adreno 620

768 MHz

GPU frequency

750 MHz

12

Execution units

2

18

Shading units

192

8

Max size

12

0.3318 TFLOPS

FLOPS

0.576 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR4X

1866 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

2x 16 Bit

29.8 Gbit/s

Max bandwidth

17 Gbit/s

Multimedia (ISP)

Yes

Neural processor (NPU)

Hexagon 696

UFS 2.1

Storage type

eMMC 5.1, UFS 3.0

3120 x 1440

Max display resolution

3200 x 1800

1x 48MP, 2x 20MP

Max camera resolution

1x 192MP

4K at 30FPS

Video capture

4K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, VP8, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X52

Connectivity

LTE Cat. 18

4G support

LTE Cat. 18

No

5G support

Yes

Up to 1200 Mbps

Download speed

Up to 3700 Mbps

Up to 150 Mbps

Upload speed

Up to 1600 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Sep 2017

Announced

Dec 2019

Flagship

Class

Mid range

Hi3670

Model number

SM7250-AB

HiSilicon Kirin 970

Official page

Qualcomm Snapdragon 765G

Related SoC Comparison

1

HiSilicon Kirin 970 vs Qualcomm Snapdragon 801

2

HiSilicon Kirin 970 vs HiSilicon Kirin 9010

3

HiSilicon Kirin 970 vs Samsung Exynos 9611

4

HiSilicon Kirin 970 vs MediaTek MT6580

5

HiSilicon Kirin 970 vs Unisoc Tiger T610

6

HiSilicon Kirin 970 vs Samsung Exynos 2100

7

HiSilicon Kirin 970 vs MediaTek Helio G95

8

HiSilicon Kirin 970 vs Qualcomm Snapdragon 662

9

HiSilicon Kirin 970 vs Apple A18

10

HiSilicon Kirin 970 vs MediaTek Dimensity 7300