Home Mobile and Tablet SoC Comparison MediaTek Dimensity 1100 vs Qualcomm Snapdragon 865 Plus

MediaTek Dimensity 1100 vs Qualcomm Snapdragon 865 Plus

MediaTek Dimensity 1100
VS
Qualcomm Snapdragon 865 Plus
MediaTek Dimensity 1100
Qualcomm Snapdragon 865 Plus
We compared two versions of phone SoCs: 8 cores 2600MHz MediaTek Dimensity 1100 vs. 8 cores 3100MHz Qualcomm Snapdragon 865 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 1100 Advantages
More modern manufacturing process (6nm vs 7nm)
Released 6 months late
Qualcomm Snapdragon 865 Plus Advantages
Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.9792 TFLOPS )
Larger memory bandwidth (44GB/s vs 34.1GB/s)
Higher Frequency (3100MHz vs 2600MHz)
Lower TDP (5W vs 10W)

Score

Benchmark

AnTuTu 10
MediaTek Dimensity 1100
786669
Qualcomm Snapdragon 865 Plus +1%
796278
Geekbench 6 Single Core
MediaTek Dimensity 1100
1107
Qualcomm Snapdragon 865 Plus +5%
1163
Geekbench 6 Multi Core
MediaTek Dimensity 1100
3332
Qualcomm Snapdragon 865 Plus
3306
FP32 (float)
MediaTek Dimensity 1100
979
Qualcomm Snapdragon 865 Plus +40%
1372
MediaTek Dimensity 1100
VS
Qualcomm Snapdragon 865 Plus

CPU

4x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
Architecture
1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
2600 MHz
Frequency
3100 MHz
8
Cores
8
ARMv8.2-A
Instruction set
ARMv8.2-A
320 KB
L2 cache
1 MB
0
L3 cache
0
6 nm
Process
7 nm
-
Transistor count
10.3
10 W
TDP
5 W
TSMC
Manufacturing
TSMC

Graphics

Mali-G77 MP9
GPU name
Adreno 650
850 MHz
GPU frequency
670 MHz
9
Execution units
2
64
Shading units
512
16
Max size
16
0.9792 TFLOPS
FLOPS
1.3721 TFLOPS
1.3
Vulkan version
1.1
2.0
OpenCL version
2.0
12
DirectX version
12.1

Memory

LPDDR4X
Memory type
LPDDR5
2133 MHz
Memory frequency
2750 MHz
4x 16 Bit
Bus
4x 16 Bit
34.1 Gbit/s
Max bandwidth
44 Gbit/s

Multimedia (ISP)

MediaTek APU 3.0
Neural processor (NPU)
Hexagon 698
UFS 3.1
Storage type
UFS 3.0, UFS 3.1
2520 x 1080
Max display resolution
3840 x 2160
1x 108MP, 2x 32MP
Max camera resolution
1x 200MP, 2x 25MP
4K at 60FPS
Video capture
8K at 30FPS, 4K at 60FPS
4K at 60FPS
Video playback
8K at 30FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP8, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Helio M70
Modem
X55

Connectivity

LTE Cat. 19
4G support
LTE Cat. 22
Yes
5G support
Yes
Up to 4700 Mbps
Download speed
Up to 7500 Mbps
Up to 2500 Mbps
Upload speed
Up to 3000 Mbps
6
Wi-Fi
6
5.2
Bluetooth
5.2
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jan 2021
Announced
Jul 2020
Flagship
Class
Flagship
MT6891Z/CZA
Model number
SM8250-AB
MediaTek Dimensity 1100
Official page
Qualcomm Snapdragon 865 Plus

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