CPU
GPU
SoC
Categories
Rankings
CPU Rankings
GPU Rankings
SoC Rankings
English
English
Close menu
Home
CPU
GPU
SoC
Categories
CPU Rankings
GPU Rankings
SoC Rankings
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
Home
Mobile and Tablet SoC Comparison
MediaTek Dimensity 1300 vs HiSilicon Kirin 710
MediaTek Dimensity 1300 vs HiSilicon Kirin 710
VS
MediaTek Dimensity 1300
HiSilicon Kirin 710
We compared two versions of phone SoCs: 8 cores 3000MHz MediaTek Dimensity 1300 vs. 8 cores 2200MHz HiSilicon Kirin 710 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 1300 Advantages
Better graphics card performance FLOPS (0.9792 TFLOPS vs 0.128 TFLOPS )
Higher Frequency (3000MHz vs 2200MHz)
More modern manufacturing process (6nm vs 12nm)
Released 3 years and 8 months late
Score
Benchmark
AnTuTu 10
MediaTek Dimensity 1300
+245%
698511
HiSilicon Kirin 710
202054
Geekbench 6 Single Core
MediaTek Dimensity 1300
+251%
1252
HiSilicon Kirin 710
356
Geekbench 6 Multi Core
MediaTek Dimensity 1300
+188%
3457
HiSilicon Kirin 710
1197
FP32 (float)
MediaTek Dimensity 1300
+664%
979
HiSilicon Kirin 710
128
MediaTek Dimensity 1300
VS
HiSilicon Kirin 710
CPU
1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
Architecture
4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
3000 MHz
Frequency
2200 MHz
8
Cores
8
-
L2 cache
512 KB
-
L3 cache
0
6 nm
Process
12 nm
-
Transistor count
5.5
-
TDP
5 W
TSMC
Manufacturing
TSMC
Graphics
Mali-G77 MP9
GPU name
Mali-G51 MP4
850 MHz
GPU frequency
1000 MHz
9
Execution units
4
64
Shading units
16
16
Max size
6
0.9792 TFLOPS
FLOPS
0.128 TFLOPS
1.3
Vulkan version
1.3
2.0
OpenCL version
2.0
12
DirectX version
12
Memory
LPDDR4X
Memory type
LPDDR4X
2133 MHz
Memory frequency
1866 MHz
4x 16 Bit
Bus
2x 32 Bit
34.1 Gbit/s
Max bandwidth
-
AI
MediaTek APU 3.0
NPU
No
Multimedia (ISP)
MediaTek APU 3.0
Neural processor (NPU)
No
UFS 3.1
Storage type
eMMC 5.1, UFS 2.1
2520 x 1080
Max display resolution
2340 x 1080
1x 200MP
Max camera resolution
1x 40MP, 2x 24MP
4K at 60FPS
Video capture
1K at 30FPS
4K at 60FPS
Video playback
1080p at 60FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP8, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Helio M70
Modem
-
Connectivity
LTE Cat. 19
4G support
LTE Cat. 12
Yes
5G support
No
Up to 4700 Mbps
Download speed
Up to 600 Mbps
Up to 2500 Mbps
Upload speed
Up to 150 Mbps
6
Wi-Fi
4
5.2
Bluetooth
4.2
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Mar 2022
Announced
Jul 2018
Flagship
Class
Mid range
MT6893Z
Model number
Hi6260
MediaTek Dimensity 1300
Official page
HiSilicon Kirin 710
Related SoC Comparison
1
MediaTek Dimensity 1300 vs Qualcomm Snapdragon 6 Gen 1
2
MediaTek Dimensity 1300 vs MediaTek Dimensity 9000
3
MediaTek Dimensity 1300 vs Qualcomm Snapdragon 865
4
MediaTek Dimensity 1300 vs MediaTek Dimensity 7050
5
MediaTek Dimensity 1300 vs MediaTek Dimensity 1200
6
MediaTek Dimensity 1300 vs Qualcomm Snapdragon 778G
7
MediaTek Dimensity 1300 vs Qualcomm Snapdragon 7 Plus Gen 3
8
MediaTek Dimensity 7200 vs MediaTek Dimensity 1300
9
MediaTek Dimensity 1300 vs MediaTek Dimensity 1000 Plus
10
MediaTek Dimensity 1300 vs HiSilicon Kirin 710F
© 2024 - TopCPU.net
Contact Us
Privacy Policy