MediaTek Dimensity 8200 vs HiSilicon Kirin 710

VS

MediaTek Dimensity 8200

HiSilicon Kirin 710

We compared two versions of phone SoCs: 8 cores 3100MHz MediaTek Dimensity 8200 vs. 8 cores 2200MHz HiSilicon Kirin 710 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 8200 Advantages

Better graphics card performance FLOPS (1.442 TFLOPS vs 0.128 TFLOPS )

Higher Frequency (3100MHz vs 2200MHz)

More modern manufacturing process (4nm vs 12nm)

Released 4 years and 5 months late

HiSilicon Kirin 710 Advantages

Lower TDP (5W vs 6W)

Score

Benchmark

AnTuTu 10

MediaTek Dimensity 8200 +347%

903370

HiSilicon Kirin 710

202054

Geekbench 6 Single Core

MediaTek Dimensity 8200 +245%

1229

HiSilicon Kirin 710

356

Geekbench 6 Multi Core

MediaTek Dimensity 8200 +227%

3924

HiSilicon Kirin 710

1197

FP32 (float)

MediaTek Dimensity 8200 +1026%

1442

HiSilicon Kirin 710

128

MediaTek Dimensity 8200

VS

HiSilicon Kirin 710

CPU

1x 3.1 GHz – Cortex A78
3x 3 GHz – Cortex A78
4x 2 GHz – Cortex A55

Architecture

4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53

3100 MHz

Frequency

2200 MHz

8

Cores

8

ARMv8.2-A

Instruction set

ARMv8-A

-

L2 cache

512 KB

0

L3 cache

0

4 nm

Process

12 nm

-

Transistor count

5.5

6 W

TDP

5 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G610 MP6

GPU name

Mali-G51 MP4

950 MHz

GPU frequency

1000 MHz

6

Execution units

4

-

Shading units

16

Max size

6

1.442 TFLOPS

FLOPS

0.128 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

-

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

2x 32 Bit

51.2 Gbit/s

Max bandwidth

-

Multimedia (ISP)

MediaTek APU 580

Neural processor (NPU)

No

UFS 3.1

Storage type

eMMC 5.1, UFS 2.1

2960 x 1440

Max display resolution

2340 x 1080

1x 320MP

Max camera resolution

1x 40MP, 2x 24MP

4K at 60FPS

Video capture

1K at 30FPS

4K at 60FPS

Video playback

1080p at 60FPS

H.264, H.265, AV1, VP9

Video codecs

H.264, H.265, VP8, VP9

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Audio codecs

AIFF, CAF, MP3, MP4, WAV

MediaTek UltraSave 2.0

Modem

-

Connectivity

LTE Cat. 21

4G support

LTE Cat. 12

Yes

5G support

No

Up to 4700 Mbps

Download speed

Up to 600 Mbps

Up to 2500 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

4

5.3

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Dec 2022

Announced

Jul 2018

Mid range

Class

Mid range

MT6896Z

Model number

Hi6260

MediaTek Dimensity 8200

Official page

HiSilicon Kirin 710

Related SoC Comparison

1

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 865 Plus

2

MediaTek Dimensity 8200 vs HiSilicon Kirin 990 4G

3

MediaTek Dimensity 8200 vs MediaTek Helio P20

4

MediaTek Dimensity 8200 vs Samsung Exynos 990

5

MediaTek Dimensity 8200 vs Samsung Exynos 980

6

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 6 Gen 1

7

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 855 Plus

8

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 680

9

MediaTek Dimensity 8200 vs HiSilicon Kirin 970

10

MediaTek Dimensity 8200 vs Qualcomm Snapdragon 625