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Mobile and Tablet SoC Comparison
MediaTek Dimensity 8300 vs HiSilicon Kirin 950
MediaTek Dimensity 8300 vs HiSilicon Kirin 950
VS
MediaTek Dimensity 8300
HiSilicon Kirin 950
We compared two versions of phone SoCs: 8 cores 3350MHz MediaTek Dimensity 8300 vs. 8 cores 2400MHz HiSilicon Kirin 950 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 8300 Advantages
Larger memory bandwidth (68.2GB/s vs 25.6GB/s)
Higher Frequency (3350MHz vs 2400MHz)
More modern manufacturing process (4nm vs 16nm)
Released 8 years late
Score
Benchmark
Geekbench 6 Single Core
MediaTek Dimensity 8300
+304%
1506
HiSilicon Kirin 950
372
Geekbench 6 Multi Core
MediaTek Dimensity 8300
+376%
4844
HiSilicon Kirin 950
1016
MediaTek Dimensity 8300
VS
HiSilicon Kirin 950
CPU
1x 3.35 GHz – Cortex-A715
3x 3.2 GHz – Cortex-A715
4x 2.2 GHz – Cortex-A510
Architecture
4x 2.4 GHz – Cortex-A72
4x 1.8 GHz – Cortex-A53
3350 MHz
Frequency
2400 MHz
8
Cores
8
ARMv9-A
Instruction set
ARMv8-A
0
L3 cache
-
4 nm
Process
16 nm
-
Transistor count
2
-
TDP
5 W
TSMC
Manufacturing
TSMC
Graphics
Mali-G615 MP6
GPU name
Mali-T880 MP4
1400 MHz
GPU frequency
900 MHz
6
Execution units
4
-
Shading units
16
24
Max size
4
-
FLOPS
0.1152 TFLOPS
1.3
Vulkan version
1.0
2.0
OpenCL version
1.2
-
DirectX version
11.2
Memory
LPDDR5X
Memory type
LPDDR4
4266 MHz
Memory frequency
-
4x 16 Bit
Bus
2x 32 Bit
68.2 Gbit/s
Max bandwidth
25.6 Gbit/s
Multimedia (ISP)
MediaTek APU 780
Neural processor (NPU)
No
UFS 4.0
Storage type
eMMC 5.1, UFS 2.0
2960 x 1440
Max display resolution
2560 x 1600
1x 320MP
Max camera resolution
1x 21MP, 2x 16MP
4K at 60FPS
Video capture
4K at 30FPS
4K at 60FPS
Video playback
4K at 30FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP8, VP9
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Connectivity
-
4G support
LTE Cat. 6
Yes
5G support
No
Up to 7900 Mbps
Download speed
Up to 300 Mbps
Up to 4200 Mbps
Upload speed
Up to 50 Mbps
6
Wi-Fi
5
5.4
Bluetooth
4.2
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Nov 2023
Announced
Nov 2015
Flagship
Class
Flagship
-
Model number
Hi3650
MediaTek Dimensity 8300
Official page
-
Related SoC Comparison
1
MediaTek Dimensity 8300 vs Qualcomm Snapdragon 670
2
MediaTek Dimensity 8300 vs MediaTek Dimensity 9200
3
MediaTek Dimensity 8300 vs HiSilicon Kirin 650
4
MediaTek Dimensity 8300 vs Qualcomm Snapdragon 4 Gen 2
5
MediaTek Dimensity 8300 vs MediaTek Helio A22
6
MediaTek Dimensity 8300 vs Apple A9
7
MediaTek Dimensity 8300 vs Samsung Exynos 980
8
MediaTek Dimensity 8300 vs HiSilicon Kirin 9000S
9
MediaTek Dimensity 8300 vs MediaTek Dimensity 1300
10
MediaTek Dimensity 8300 vs Samsung Exynos 9825
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