Qualcomm Snapdragon 678 vs HiSilicon Kirin 970

VS

Qualcomm Snapdragon 678

HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 2200MHz Qualcomm Snapdragon 678 vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 678 Advantages

Lower TDP (6W vs 9W)

Released 3 years and 3 months late

HiSilicon Kirin 970 Advantages

Better graphics card performance FLOPS (0.3318 TFLOPS vs 0.3244 TFLOPS )

Larger memory bandwidth (29.8GB/s vs 14.9GB/s)

Higher Frequency (2360MHz vs 2200MHz)

More modern manufacturing process (10nm vs 11nm)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 678

340607

HiSilicon Kirin 970 +4%

355946

Geekbench 6 Single Core

Qualcomm Snapdragon 678 +77%

685

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

Qualcomm Snapdragon 678 +13%

1568

HiSilicon Kirin 970

1377

FP32 (float)

Qualcomm Snapdragon 678

324

HiSilicon Kirin 970 +2%

331

Qualcomm Snapdragon 678

VS

HiSilicon Kirin 970

CPU

2x 2.2 GHz – Kryo 460 Gold (Cortex-A76)
6x 1.7 GHz – Kryo 460 Silver (Cortex-A55)

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

2200 MHz

Frequency

2360 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8-A

256 KB

L2 cache

2 MB

-

L3 cache

0

11 nm

Process

10 nm

-

Transistor count

5.5

6 W

TDP

9 W

Samsung

Manufacturing

TSMC

Graphics

Adreno 612

GPU name

Mali-G72 MP12

845 MHz

GPU frequency

768 MHz

2

Execution units

12

96

Shading units

18

8

Max size

8

0.3244 TFLOPS

FLOPS

0.3318 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR4X

Memory type

LPDDR4X

1866 MHz

Memory frequency

1866 MHz

2x 16 Bit

Bus

4x 16 Bit

14.9 Gbit/s

Max bandwidth

29.8 Gbit/s

Multimedia (ISP)

Hexagon 685

Neural processor (NPU)

Yes

eMMC 5.1, UFS 2.1

Storage type

UFS 2.1

2520 x 1080

Max display resolution

3120 x 1440

1x 192MP, 2x 25MP

Max camera resolution

1x 48MP, 2x 20MP

4K at 30FPS

Video capture

4K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

32 bit@384 kHz, HD-audio

X12

Modem

-

Connectivity

LTE Cat. 12

4G support

LTE Cat. 18

No

5G support

No

Up to 600 Mbps

Download speed

Up to 1200 Mbps

Up to 150 Mbps

Upload speed

Up to 150 Mbps

5

Wi-Fi

5

5.0

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Dec 2020

Announced

Sep 2017

Mid range

Class

Flagship

SM6150-AC

Model number

Hi3670

Qualcomm Snapdragon 678

Official page

HiSilicon Kirin 970

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