Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 9000

VS

Qualcomm Snapdragon 865 Plus MediaTek Dimensity 9000

We compared two versions of phone SoCs: 8 cores 3100MHz Qualcomm Snapdragon 865 Plus vs. 8 cores 3050MHz MediaTek Dimensity 9000 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 865 Plus Advantages

Higher Frequency (3100MHz vs 3050MHz)

MediaTek Dimensity 9000 Advantages

Better graphics card performance FLOPS (1.632 TFLOPS vs 1.3721 TFLOPS )

Larger memory bandwidth (60GB/s vs 44GB/s)

More modern manufacturing process (4nm vs 7nm)

Lower TDP (4W vs 5W)

Released 1 years and 4 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 865 Plus

796278

MediaTek Dimensity 9000 +36%

1084030

Geekbench 6 Single Core

Qualcomm Snapdragon 865 Plus

1163

MediaTek Dimensity 9000 +37%

1599

Geekbench 6 Multi Core

Qualcomm Snapdragon 865 Plus

3306

MediaTek Dimensity 9000 +27%

4199

FP32 (float)

Qualcomm Snapdragon 865 Plus

1372

MediaTek Dimensity 9000 +18%

1632

Qualcomm Snapdragon 865 Plus

VS

MediaTek Dimensity 9000

CPU

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Architecture

1x 3.05 GHz – Cortex-X2
3x 2.85 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510

3100 MHz

Frequency

3050 MHz

8

Cores

8

1 MB

L2 cache

1 MB

0

L3 cache

0

7 nm

Process

4 nm

10.3

Transistor count

-

5 W

TDP

4 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 650

GPU name

Mali-G710 MP10

670 MHz

GPU frequency

850 MHz

2

Execution units

10

512

Shading units

96

16

Max size

24

1.3721 TFLOPS

FLOPS

1.632 TFLOPS

1.1

Vulkan version

1.1

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR5X

2750 MHz

Memory frequency

3750 MHz

4x 16 Bit

Bus

4x 16 Bit

44 Gbit/s

Max bandwidth

60 Gbit/s

AI

Hexagon 698

NPU

Yes

Multimedia (ISP)

Hexagon 698

Neural processor (NPU)

Yes

UFS 3.0, UFS 3.1

Storage type

UFS 3.1

3840 x 2160

Max display resolution

3200 x 1440

1x 200MP, 2x 25MP

Max camera resolution

1x 320MP, 3x 32MP

8K at 30FPS, 4K at 60FPS

Video capture

4K at 60FPS

8K at 30FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X55

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 24

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 7000 Mbps

Up to 3000 Mbps

Upload speed

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Jul 2020

Announced

Nov 2021

Flagship

Class

Flagship

SM8250-AB

Model number

MT6983

Qualcomm Snapdragon 865 Plus

Official page

MediaTek Dimensity 9000

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