MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 7 Plus Gen 2

VS

MediaTek Dimensity 1000 Plus

Qualcomm Snapdragon 7 Plus Gen 2

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 1000 Plus vs. 8 teras 2910MHz Qualcomm Snapdragon 7 Plus Gen 2. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1000 Plus Kelebihan

Lebar jalur memori yang lebih besar (29.87GB/s vs 25.6GB/s)

Qualcomm Snapdragon 7 Plus Gen 2 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.7817 TFLOPS vs 0.9792 TFLOPS )

Tinggi Frekuensi (2910MHz vs 2600MHz)

Proses pembuatan yang lebih moden (4nm vs 7nm)

Penggunaan kuasa lebih rendah (6W berbanding 10W)

Dikeluarkan lewat 2 tahun dan 10 bulan

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1000 Plus

523574

Qualcomm Snapdragon 7 Plus Gen 2 +112%

1112797

Geekbench 6 Single Core

MediaTek Dimensity 1000 Plus

1040

Qualcomm Snapdragon 7 Plus Gen 2 +63%

1699

Geekbench 6 Multi Core

MediaTek Dimensity 1000 Plus

3152

Qualcomm Snapdragon 7 Plus Gen 2 +40%

4419

FP32 (float)

MediaTek Dimensity 1000 Plus

979

Qualcomm Snapdragon 7 Plus Gen 2 +81%

1781

MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 7 Plus Gen 2

CPU

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

Seni bina

1x 2.91 GHz – Cortex-X2
3x 2.49 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510

2600 MHz

Frekuensi

2910 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv9-A

-

Cache L2

2 MB

0

Cache L3

0

7 nm

Proses

4 nm

-

Bilangan transistor

10.2

10 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G77 MP9

Nama GPU

Adreno 725

850 MHz

Frekuensi GPU

580 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

768

16

Saiz maks

16

0.9792 TFLOPS

FLOPS

1.7817 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

1866 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

2x 16 Bit

29.87 Gbit/s

Lebar jalur maks

25.6 Gbit/s

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Yes

UFS 2.2

Jenis storan

UFS 3.1

2520 x 1080

Resolusi paparan maks

3360 x 1600

1x 80MP, 2x 32MP

Resolusi kamera maks

1x 200MP

4K at 30FPS

Rakaman video

4K at 60FPS

4K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X62

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 4400 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 1600 Mbps

6

Wi-Fi

6

5.1

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo, QZSS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Mei 2020

Diumumkan

Mac 2023

Flagship

Kelas

Mid range

MT6889Z/CZA

Nombor model

SM7475-AB

MediaTek Dimensity 1000 Plus

Halaman rasmi

Qualcomm Snapdragon 7 Plus Gen 2

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