MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 778G Plus

VS

MediaTek Dimensity 1000 Plus Qualcomm Snapdragon 778G Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 1000 Plus vs. 8 teras 2500MHz Qualcomm Snapdragon 778G Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 1000 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.8448 TFLOPS )

Lebar jalur memori yang lebih besar (29.87GB/s vs 25.6GB/s)

Tinggi Frekuensi (2600MHz vs 2500MHz)

Qualcomm Snapdragon 778G Plus Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Penggunaan kuasa lebih rendah (5W berbanding 10W)

Dikeluarkan lewat 1 tahun dan 5 bulan

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 1000 Plus

523574

Qualcomm Snapdragon 778G Plus +17%

616678

Geekbench 6 Single Core

MediaTek Dimensity 1000 Plus

1040

Qualcomm Snapdragon 778G Plus +2%

1069

Geekbench 6 Multi Core

MediaTek Dimensity 1000 Plus +4%

3152

Qualcomm Snapdragon 778G Plus

3008

FP32 (float)

MediaTek Dimensity 1000 Plus +15%

979

Qualcomm Snapdragon 778G Plus

844

MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 778G Plus

CPU

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

Seni bina

1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

2600 MHz

Frekuensi

2500 MHz

8

Teras

8

-

Cache L2

2 MB

0

Cache L3

-

7 nm

Proses

6 nm

10 W

TDP

5 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G77 MP9

Nama GPU

Adreno 642

850 MHz

Frekuensi GPU

550 MHz

9

Unit pelaksanaan

2

64

Unit pewarnaan

384

16

Saiz maks

16

0.9792 TFLOPS

FLOPS

0.8448 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

1866 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

2x 16 Bit

29.87 Gbit/s

Lebar jalur maks

25.6 Gbit/s

AI

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 770

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 770

UFS 2.2

Jenis storan

UFS 2.2, UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

2520 x 1080

1x 80MP, 2x 32MP

Resolusi kamera maks

1x 192MP

4K at 30FPS

Rakaman video

4K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X53

Kesambungan

LTE Cat. 19

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 4700 Mbps

Kelajuan muat turun

Up to 3700 Mbps

Up to 2500 Mbps

Kelajuan muat naik

Up to 1600 Mbps

6

Wi-Fi

6

5.1

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Mei 2020

Diumumkan

Okt 2021

Flagship

Kelas

Mid range

MT6889Z/CZA

Nombor model

SM7325-AE

MediaTek Dimensity 1000 Plus

Halaman rasmi

Qualcomm Snapdragon 778G Plus

Perbandingan SoC Berkaitan

1

MediaTek Dimensity 1000 Plus vs MediaTek Dimensity 1000L

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MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 6 Gen 1

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4

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 4 Gen 2

5

MediaTek Dimensity 1000 Plus vs MediaTek Dimensity 1100

6

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 865

7

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 695

8

Qualcomm Snapdragon 7s Gen 2 vs MediaTek Dimensity 1000 Plus

9

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 450

10

MediaTek Dimensity 1000 Plus vs Qualcomm Snapdragon 690