MediaTek Dimensity 7050 vs Qualcomm Snapdragon 870

VS

MediaTek Dimensity 7050 Qualcomm Snapdragon 870

Kami membandingkan dua versi SoC telefon: 8 teras 2600MHz MediaTek Dimensity 7050 vs. 8 teras 3200MHz Qualcomm Snapdragon 870. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 7050 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Penggunaan kuasa lebih rendah (4W berbanding 6W)

Dikeluarkan lewat 2 tahun dan 4 bulan

Qualcomm Snapdragon 870 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.686 TFLOPS )

Tinggi Frekuensi (3200MHz vs 2600MHz)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 7050

535270

Qualcomm Snapdragon 870 +51%

810488

Geekbench 6 Single Core

MediaTek Dimensity 7050

962

Qualcomm Snapdragon 870 +19%

1151

Geekbench 6 Multi Core

MediaTek Dimensity 7050

2364

Qualcomm Snapdragon 870 +41%

3336

FP32 (float)

MediaTek Dimensity 7050

686

Qualcomm Snapdragon 870 +100%

1372

MediaTek Dimensity 7050

VS

Qualcomm Snapdragon 870

CPU

2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

Seni bina

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2600 MHz

Frekuensi

3200 MHz

8

Teras

8

-

Cache L2

1 MB

-

Cache L3

0

6 nm

Proses

7 nm

-

Bilangan transistor

10.3

4 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G68 MP4

Nama GPU

Adreno 650

800 MHz

Frekuensi GPU

670 MHz

4

Unit pelaksanaan

2

-

Unit pewarnaan

512

16

Saiz maks

16

0.686 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

-

Versi DirectX

12.1

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

2750 MHz

4x 16 Bit

Bas

4x 16 Bit

-

Lebar jalur maks

44 Gbit/s

AI

MediaTek APU 550

Pemproses neural (NPU)

Hexagon 698

Multimedia (ISP)

MediaTek APU 550

Pemproses neural (NPU)

Hexagon 698

UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 200MP

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 30FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

4K at 30FPS

Main balik video

8K at 30FPS, 4K at 60FPS

H.264, H.265, VP9

Codec video

H.264, H.265, VP8, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X55

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 2770 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 1250 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Mei 2023

Diumumkan

Jan 2021

Mid range

Kelas

Flagship

MT6877 MT6877V/TTZA

Nombor model

SM8250-AC

MediaTek Dimensity 7050

Halaman rasmi

Qualcomm Snapdragon 870

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