MediaTek Dimensity 810 vs Qualcomm Snapdragon 865

VS

MediaTek Dimensity 810

Qualcomm Snapdragon 865

Kami membandingkan dua versi SoC telefon: 8 teras 2400MHz MediaTek Dimensity 810 vs. 8 teras 2840MHz Qualcomm Snapdragon 865. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 810 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Dikeluarkan lewat 1 tahun dan 8 bulan

Qualcomm Snapdragon 865 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.2021 TFLOPS vs 0.243 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 17.07GB/s)

Tinggi Frekuensi (2840MHz vs 2400MHz)

Penggunaan kuasa lebih rendah (5W berbanding 6W)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 810

433200

Qualcomm Snapdragon 865 +70%

738889

Geekbench 6 Single Core

MediaTek Dimensity 810

787

Qualcomm Snapdragon 865 +43%

1128

Geekbench 6 Multi Core

MediaTek Dimensity 810

1945

Qualcomm Snapdragon 865 +68%

3277

FP32 (float)

MediaTek Dimensity 810

243

Qualcomm Snapdragon 865 +394%

1202

MediaTek Dimensity 810

VS

Qualcomm Snapdragon 865

CPU

2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

Seni bina

1x 2.84 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2400 MHz

Frekuensi

2840 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

1 MB

0

Cache L3

0

6 nm

Proses

7 nm

12

Bilangan transistor

10.3

6 W

TDP

5 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G57 MP2

Nama GPU

Adreno 650

950 MHz

Frekuensi GPU

587 MHz

2

Unit pelaksanaan

2

64

Unit pewarnaan

512

16

Saiz maks

16

0.243 TFLOPS

FLOPS

1.2021 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR4X

Jenis memori

LPDDR5

2133 MHz

Frekuensi memori

2750 MHz

2x 16 Bit

Bas

4x 16 Bit

17.07 Gbit/s

Lebar jalur maks

44 Gbit/s

Multimedia (ISP)

MediaTek APU 3.0

Pemproses neural (NPU)

Hexagon 698

UFS 2.2

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 64MP, 2x 16MP

Resolusi kamera maks

1x 200MP, 2x 25MP

2K at 30FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

2K at 30FPS

Main balik video

8K at 30FPS, 4K at 60FPS

H.264, H.265, VP9

Codec video

H.264, H.265, VP8, VP9

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X55

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 2770 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 1250 Mbps

Kelajuan muat naik

Up to 3000 Mbps

5

Wi-Fi

6

5.1

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Ogo 2021

Diumumkan

Dis 2019

Mid range

Kelas

Flagship

MT6833V

Nombor model

SM8250-AB

MediaTek Dimensity 810

Halaman rasmi

Qualcomm Snapdragon 865

Perbandingan SoC Berkaitan

1

MediaTek Dimensity 810 vs Samsung Exynos 7872

2

MediaTek Dimensity 810 vs Qualcomm Snapdragon 8s Gen 3

3

MediaTek Dimensity 810 vs HiSilicon Kirin 655

4

MediaTek Dimensity 810 vs Qualcomm Snapdragon 835

5

MediaTek Dimensity 810 vs MediaTek Helio G25

6

MediaTek Dimensity 810 vs Qualcomm Snapdragon 8 Gen 3

7

MediaTek Dimensity 810 vs Qualcomm Snapdragon 630

8

MediaTek Dimensity 810 vs Samsung Exynos 9609

9

MediaTek Dimensity 810 vs MediaTek Helio G100

10

MediaTek Dimensity 810 vs HiSilicon Kirin 990 4G