MediaTek Dimensity 900 vs Qualcomm Snapdragon 870

VS

MediaTek Dimensity 900

Qualcomm Snapdragon 870

Kami membandingkan dua versi SoC telefon: 8 teras 2400MHz MediaTek Dimensity 900 vs. 8 teras 3200MHz Qualcomm Snapdragon 870. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 900 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Penggunaan kuasa lebih rendah (4W berbanding 6W)

Qualcomm Snapdragon 870 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.621 TFLOPS )

Lebar jalur memori yang lebih besar (44GB/s vs 18.4GB/s)

Tinggi Frekuensi (3200MHz vs 2400MHz)

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 900

516049

Qualcomm Snapdragon 870 +57%

810488

Geekbench 6 Single Core

MediaTek Dimensity 900

898

Qualcomm Snapdragon 870 +28%

1151

Geekbench 6 Multi Core

MediaTek Dimensity 900

2240

Qualcomm Snapdragon 870 +48%

3336

FP32 (float)

MediaTek Dimensity 900

621

Qualcomm Snapdragon 870 +120%

1372

MediaTek Dimensity 900

VS

Qualcomm Snapdragon 870

CPU

2x 2.4 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

Seni bina

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2400 MHz

Frekuensi

3200 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

-

Cache L2

1 MB

0

Cache L3

0

6 nm

Proses

7 nm

10

Bilangan transistor

10.3

4 W

TDP

6 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G68 MP4

Nama GPU

Adreno 650

900 MHz

Frekuensi GPU

670 MHz

4

Unit pelaksanaan

2

48

Unit pewarnaan

512

16

Saiz maks

16

0.621 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12

Versi DirectX

12.1

Memori

LPDDR5

Jenis memori

LPDDR5

3200 MHz

Frekuensi memori

2750 MHz

4x 16 Bit

Bas

4x 16 Bit

18.4 Gbit/s

Lebar jalur maks

44 Gbit/s

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Hexagon 698

UFS 2.1, UFS 3.1

Jenis storan

UFS 3.0, UFS 3.1

2520 x 1080

Resolusi paparan maks

3840 x 2160

1x 108MP, 2x 20MP

Resolusi kamera maks

1x 200MP, 2x 25MP

4K at 30FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

4K at 30FPS

Main balik video

8K at 30FPS, 4K at 60FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X55

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 22

Yes

Sokongan 5G

Yes

Up to 2770 Mbps

Kelajuan muat turun

Up to 7500 Mbps

Up to 1250 Mbps

Kelajuan muat naik

Up to 3000 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Mei 2021

Diumumkan

Jan 2021

Mid range

Kelas

Flagship

MT6877

Nombor model

SM8250-AC

MediaTek Dimensity 900

Halaman rasmi

Qualcomm Snapdragon 870

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MediaTek Dimensity 900 vs MediaTek Dimensity 9400

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MediaTek Dimensity 900 vs Samsung Exynos 2400

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MediaTek Dimensity 900 vs Unisoc Tiger T615

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MediaTek Dimensity 900 vs Samsung Exynos 7570

8

MediaTek Dimensity 900 vs MediaTek Helio P90

9

MediaTek Dimensity 900 vs Qualcomm Snapdragon 865 Plus

10

MediaTek Dimensity 900 vs Samsung Exynos 1080