Qualcomm Snapdragon 480 Plus vs MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 480 Plus MediaTek Dimensity 1000 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2200MHz Qualcomm Snapdragon 480 Plus vs. 8 teras 2600MHz MediaTek Dimensity 1000 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 480 Plus Kelebihan

Penggunaan kuasa lebih rendah (3W berbanding 10W)

Dikeluarkan lewat 1 tahun dan 5 bulan

MediaTek Dimensity 1000 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.4864 TFLOPS )

Lebar jalur memori yang lebih besar (29.87GB/s vs 17GB/s)

Tinggi Frekuensi (2600MHz vs 2200MHz)

Proses pembuatan yang lebih moden (7nm vs 8nm)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 480 Plus

363972

MediaTek Dimensity 1000 Plus +43%

523574

Geekbench 6 Single Core

Qualcomm Snapdragon 480 Plus

866

MediaTek Dimensity 1000 Plus +20%

1040

Geekbench 6 Multi Core

Qualcomm Snapdragon 480 Plus

1859

MediaTek Dimensity 1000 Plus +69%

3152

FP32 (float)

Qualcomm Snapdragon 480 Plus

486

MediaTek Dimensity 1000 Plus +101%

979

Qualcomm Snapdragon 480 Plus

VS

MediaTek Dimensity 1000 Plus

CPU

2x 2.2 GHz – Kryo 460 Gold (Cortex-A76)
6x 1.8 GHz – Kryo 460 Silver (Cortex-A55)

Seni bina

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

2200 MHz

Frekuensi

2600 MHz

8

Teras

8

-

Cache L3

0

8 nm

Proses

7 nm

3 W

TDP

10 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 619

Nama GPU

Mali-G77 MP9

950 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

9

128

Unit pewarnaan

64

8

Saiz maks

16

0.4864 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR4X

Jenis memori

LPDDR4X

2133 MHz

Frekuensi memori

1866 MHz

2x 16 Bit

Bas

4x 16 Bit

17 Gbit/s

Lebar jalur maks

29.87 Gbit/s

AI

Hexagon 686

Pemproses neural (NPU)

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 686

Pemproses neural (NPU)

MediaTek APU 3.0

eMMC 5.1, UFS 2.2

Jenis storan

UFS 2.2

2520 x 1080

Resolusi paparan maks

2520 x 1080

1x 64MP, 2x 25MP

Resolusi kamera maks

1x 80MP, 2x 32MP

1K at 60FPS

Rakaman video

4K at 30FPS

1080p at 60FPS

Main balik video

4K at 30FPS

H.264, H.265, VP9

Codec video

H.264, H.265, AV1, VP9

AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

Snapdragon X51

Modem

Helio M70

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 19

Yes

Sokongan 5G

Yes

Up to 2500 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 800 Mbps

Kelajuan muat naik

Up to 2500 Mbps

5

Wi-Fi

6

5.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Okt 2021

Diumumkan

Mei 2020

Low end

Kelas

Flagship

SM4350-AC

Nombor model

MT6889Z/CZA

Qualcomm Snapdragon 480 Plus

Halaman rasmi

MediaTek Dimensity 1000 Plus

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