Qualcomm Snapdragon 7 Plus Gen 2 vs HiSilicon Kirin 810

VS

Qualcomm Snapdragon 7 Plus Gen 2 HiSilicon Kirin 810

Kami membandingkan dua versi SoC telefon: 8 teras 2910MHz Qualcomm Snapdragon 7 Plus Gen 2 vs. 8 teras 2270MHz HiSilicon Kirin 810. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 7 Plus Gen 2 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.7817 TFLOPS vs 0.2362 TFLOPS )

Tinggi Frekuensi (2910MHz vs 2270MHz)

Proses pembuatan yang lebih moden (4nm vs 7nm)

Dikeluarkan lewat 3 tahun dan 9 bulan

HiSilicon Kirin 810 Kelebihan

Lebar jalur memori yang lebih besar (31.78GB/s vs 25.6GB/s)

Penggunaan kuasa lebih rendah (5W berbanding 6W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 7 Plus Gen 2 +165%

1112797

HiSilicon Kirin 810

418563

Geekbench 6 Single Core

Qualcomm Snapdragon 7 Plus Gen 2 +118%

1699

HiSilicon Kirin 810

778

Geekbench 6 Multi Core

Qualcomm Snapdragon 7 Plus Gen 2 +121%

4419

HiSilicon Kirin 810

1992

FP32 (float)

Qualcomm Snapdragon 7 Plus Gen 2 +654%

1781

HiSilicon Kirin 810

236

Qualcomm Snapdragon 7 Plus Gen 2

VS

HiSilicon Kirin 810

CPU

1x 2.91 GHz – Cortex-X2
3x 2.49 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510

Seni bina

2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55

2910 MHz

Frekuensi

2270 MHz

8

Teras

8

2 MB

Cache L2

1 MB

0

Cache L3

-

4 nm

Proses

7 nm

10.2

Bilangan transistor

6.9

6 W

TDP

5 W

TSMC

Pembuatan

-

Grafik

Adreno 725

Nama GPU

Mali-G52 MP6

580 MHz

Frekuensi GPU

820 MHz

2

Unit pelaksanaan

6

768

Unit pewarnaan

24

16

Saiz maks

8

1.7817 TFLOPS

FLOPS

0.2362 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

2133 MHz

2x 16 Bit

Bas

4x 16 Bit

25.6 Gbit/s

Lebar jalur maks

31.78 Gbit/s

AI

Yes

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Yes

Pemproses neural (NPU)

Yes

UFS 3.1

Jenis storan

eMMC 5.1, UFS 2.1

3360 x 1600

Resolusi paparan maks

3840 x 2160

1x 200MP

Resolusi kamera maks

1x 48MP, 2x 20MP

4K at 60FPS

Rakaman video

1K at 30FPS

4K at 60FPS

Main balik video

1080p at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X62

Modem

-

Kesambungan

LTE Cat. 24

Sokongan 4G

LTE Cat. 12

Yes

Sokongan 5G

No

Up to 4400 Mbps

Kelajuan muat turun

Up to 600 Mbps

Up to 1600 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

6

5.3

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Mac 2023

Diumumkan

Jun 2019

Mid range

Kelas

Mid range

SM7475-AB

Nombor model

Hi6280

Qualcomm Snapdragon 7 Plus Gen 2

Halaman rasmi

HiSilicon Kirin 810

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 7 Plus Gen 2 vs MediaTek Dimensity 8300

2

MediaTek Dimensity 7200 Ultra vs Qualcomm Snapdragon 7 Plus Gen 2

3

Samsung Exynos 1480 vs Qualcomm Snapdragon 7 Plus Gen 2

4

Unisoc T820 vs Qualcomm Snapdragon 7 Plus Gen 2

5

Qualcomm Snapdragon 888 vs Qualcomm Snapdragon 7 Plus Gen 2

6

Apple A14 Bionic vs Qualcomm Snapdragon 7 Plus Gen 2

7

Qualcomm Snapdragon 7 Plus Gen 2 vs Qualcomm Snapdragon 860

8

MediaTek Helio G99 vs HiSilicon Kirin 810

9

Qualcomm Snapdragon 7 Plus Gen 2 vs Samsung Exynos 1480

10

Qualcomm Snapdragon 7 Plus Gen 2 vs MediaTek Dimensity 6300