Qualcomm Snapdragon 778G Plus vs MediaTek Dimensity 9000

VS

Qualcomm Snapdragon 778G Plus MediaTek Dimensity 9000

Kami membandingkan dua versi SoC telefon: 8 teras 2500MHz Qualcomm Snapdragon 778G Plus vs. 8 teras 3050MHz MediaTek Dimensity 9000. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 9000 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.632 TFLOPS vs 0.8448 TFLOPS )

Lebar jalur memori yang lebih besar (60GB/s vs 25.6GB/s)

Tinggi Frekuensi (3050MHz vs 2500MHz)

Proses pembuatan yang lebih moden (4nm vs 6nm)

Penggunaan kuasa lebih rendah (4W berbanding 5W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 778G Plus

616678

MediaTek Dimensity 9000 +75%

1084030

Geekbench 6 Single Core

Qualcomm Snapdragon 778G Plus

1069

MediaTek Dimensity 9000 +49%

1599

Geekbench 6 Multi Core

Qualcomm Snapdragon 778G Plus

3008

MediaTek Dimensity 9000 +39%

4199

FP32 (float)

Qualcomm Snapdragon 778G Plus

844

MediaTek Dimensity 9000 +93%

1632

Qualcomm Snapdragon 778G Plus

VS

MediaTek Dimensity 9000

CPU

1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

Seni bina

1x 3.05 GHz – Cortex-X2
3x 2.85 GHz – Cortex-A710
4x 1.8 GHz – Cortex-A510

2500 MHz

Frekuensi

3050 MHz

8

Teras

8

2 MB

Cache L2

1 MB

-

Cache L3

0

6 nm

Proses

4 nm

5 W

TDP

4 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 642

Nama GPU

Mali-G710 MP10

550 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

10

384

Unit pewarnaan

96

16

Saiz maks

24

0.8448 TFLOPS

FLOPS

1.632 TFLOPS

1.1

Versi Vulkan

1.1

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR5X

3200 MHz

Frekuensi memori

3750 MHz

2x 16 Bit

Bas

4x 16 Bit

25.6 Gbit/s

Lebar jalur maks

60 Gbit/s

AI

Hexagon 770

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Hexagon 770

Pemproses neural (NPU)

Yes

UFS 2.2, UFS 3.0, UFS 3.1

Jenis storan

UFS 3.1

2520 x 1080

Resolusi paparan maks

3200 x 1440

1x 192MP

Resolusi kamera maks

1x 320MP, 3x 32MP

4K at 30FPS

Rakaman video

4K at 60FPS

4K at 30FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X53

Modem

-

Kesambungan

LTE Cat. 24

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 3700 Mbps

Kelajuan muat turun

Up to 7000 Mbps

Up to 1600 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.3

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Okt 2021

Diumumkan

Nov 2021

Mid range

Kelas

Flagship

SM7325-AE

Nombor model

MT6983

Qualcomm Snapdragon 778G Plus

Halaman rasmi

MediaTek Dimensity 9000

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