Qualcomm Snapdragon 8 Gen 2 vs HiSilicon Kirin 810

VS

Qualcomm Snapdragon 8 Gen 2 HiSilicon Kirin 810

Kami membandingkan dua versi SoC telefon: 8 teras 3200MHz Qualcomm Snapdragon 8 Gen 2 vs. 8 teras 2270MHz HiSilicon Kirin 810. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 8 Gen 2 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (3.4816 TFLOPS vs 0.2362 TFLOPS )

Lebar jalur memori yang lebih besar (64GB/s vs 31.78GB/s)

Tinggi Frekuensi (3200MHz vs 2270MHz)

Proses pembuatan yang lebih moden (4nm vs 7nm)

Dikeluarkan lewat 3 tahun dan 5 bulan

HiSilicon Kirin 810 Kelebihan

Penggunaan kuasa lebih rendah (5W berbanding 6.3W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 8 Gen 2 +266%

1534534

HiSilicon Kirin 810

418563

Geekbench 6 Single Core

Qualcomm Snapdragon 8 Gen 2 +157%

2004

HiSilicon Kirin 810

778

Geekbench 6 Multi Core

Qualcomm Snapdragon 8 Gen 2 +168%

5344

HiSilicon Kirin 810

1992

FP32 (float)

Qualcomm Snapdragon 8 Gen 2 +1375%

3481

HiSilicon Kirin 810

236

Qualcomm Snapdragon 8 Gen 2

VS

HiSilicon Kirin 810

CPU

1x 3.2 GHz – Cortex-X3
2x 2.8 GHz – Cortex-A715
2x 2.8 GHz – Cortex-A710
3x 2 GHz – Cortex-A510

Seni bina

2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55

3200 MHz

Frekuensi

2270 MHz

8

Teras

8

1 MB

Cache L2

1 MB

0

Cache L3

-

4 nm

Proses

7 nm

-

Bilangan transistor

6.9

6.3 W

TDP

5 W

TSMC

Pembuatan

-

Grafik

Adreno 740

Nama GPU

Mali-G52 MP6

680 MHz

Frekuensi GPU

820 MHz

2

Unit pelaksanaan

6

1280

Unit pewarnaan

24

Saiz maks

8

3.4816 TFLOPS

FLOPS

0.2362 TFLOPS

1.3

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5X

Jenis memori

LPDDR4X

4200 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

64 Gbit/s

Lebar jalur maks

31.78 Gbit/s

AI

Hexagon

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Hexagon

Pemproses neural (NPU)

Yes

UFS 3.1, UFS 4.0

Jenis storan

eMMC 5.1, UFS 2.1

3840 x 2160

Resolusi paparan maks

3840 x 2160

1x 200MP

Resolusi kamera maks

1x 48MP, 2x 20MP

8K at 30FPS, 4K at 120FPS

Rakaman video

1K at 30FPS

8K at 60FPS, 4K at 120FPS

Main balik video

1080p at 60FPS

H.264, H.265, AV1, VP8, VP9

Codec video

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

Snapdragon X70

Modem

-

Kesambungan

LTE Cat. 24

Sokongan 4G

LTE Cat. 12

Yes

Sokongan 5G

No

Up to 10000 Mbps

Kelajuan muat turun

Up to 600 Mbps

Up to 3500 Mbps

Kelajuan muat naik

Up to 150 Mbps

7

Wi-Fi

6

5.3

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Nov 2022

Diumumkan

Jun 2019

Flagship

Kelas

Mid range

SM8550-AB

Nombor model

Hi6280

Qualcomm Snapdragon 8 Gen 2

Halaman rasmi

HiSilicon Kirin 810

Perbandingan SoC Berkaitan

1

MediaTek Dimensity 8300 vs Qualcomm Snapdragon 8 Gen 2

2

MediaTek Dimensity 7200 Ultra vs Qualcomm Snapdragon 8 Gen 2

3

Qualcomm Snapdragon 8s Gen 3 vs Qualcomm Snapdragon 8 Gen 2

4

Samsung Exynos 1480 vs Qualcomm Snapdragon 8 Gen 2

5

Qualcomm Snapdragon 8 Gen 2 vs Apple A15 Bionic

6

Qualcomm Snapdragon 7s Gen 2 vs Qualcomm Snapdragon 8 Gen 2

7

Google Tensor G3 vs Qualcomm Snapdragon 8 Gen 2

8

MediaTek Helio G99 vs HiSilicon Kirin 810

9

Qualcomm Snapdragon 8 Gen 2 vs Qualcomm Snapdragon 425

10

Qualcomm Snapdragon 8 Gen 2 vs MediaTek Dimensity 7300