Qualcomm Snapdragon 845 vs MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 845 MediaTek Dimensity 1000 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2800MHz Qualcomm Snapdragon 845 vs. 8 teras 2600MHz MediaTek Dimensity 1000 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 845 Kelebihan

Tinggi Frekuensi (2800MHz vs 2600MHz)

Penggunaan kuasa lebih rendah (9W berbanding 10W)

MediaTek Dimensity 1000 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.727 TFLOPS )

Lebar jalur memori yang lebih besar (29.87GB/s vs 29.8GB/s)

Proses pembuatan yang lebih moden (7nm vs 10nm)

Dikeluarkan lewat 2 tahun dan 5 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 845

448489

MediaTek Dimensity 1000 Plus +16%

523574

Geekbench 6 Single Core

Qualcomm Snapdragon 845

566

MediaTek Dimensity 1000 Plus +83%

1040

Geekbench 6 Multi Core

Qualcomm Snapdragon 845

2075

MediaTek Dimensity 1000 Plus +51%

3152

FP32 (float)

Qualcomm Snapdragon 845

727

MediaTek Dimensity 1000 Plus +34%

979

Qualcomm Snapdragon 845

VS

MediaTek Dimensity 1000 Plus

CPU

4x 2.8 GHz – Kryo 385 Gold (Cortex-A75)
4x 1.8 GHz – Kryo 385 Silver (Cortex-A55)

Seni bina

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

2800 MHz

Frekuensi

2600 MHz

8

Teras

8

256 KB

Cache L2

-

0

Cache L3

0

10 nm

Proses

7 nm

3

Bilangan transistor

-

9 W

TDP

10 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 630

Nama GPU

Mali-G77 MP9

710 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

9

256

Unit pewarnaan

64

8

Saiz maks

16

0.727 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR4X

Jenis memori

LPDDR4X

1866 MHz

Frekuensi memori

1866 MHz

2x 32 Bit

Bas

4x 16 Bit

29.8 Gbit/s

Lebar jalur maks

29.87 Gbit/s

AI

Hexagon 685

Pemproses neural (NPU)

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 685

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 2.1

Jenis storan

UFS 2.2

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 192MP

Resolusi kamera maks

1x 80MP, 2x 32MP

4K at 60FPS

Rakaman video

4K at 30FPS

4K at 60FPS

Main balik video

4K at 30FPS

H.264, H.265, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X20

Modem

Helio M70

Kesambungan

LTE Cat. 18

Sokongan 4G

LTE Cat. 19

No

Sokongan 5G

Yes

Up to 1200 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 150 Mbps

Kelajuan muat naik

Up to 2500 Mbps

5

Wi-Fi

6

5.0

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Dis 2017

Diumumkan

Mei 2020

Flagship

Kelas

Flagship

SDM845

Nombor model

MT6889Z/CZA

Qualcomm Snapdragon 845

Halaman rasmi

MediaTek Dimensity 1000 Plus

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