Qualcomm Snapdragon 855 vs MediaTek Dimensity 1300

VS

Qualcomm Snapdragon 855 MediaTek Dimensity 1300

Kami membandingkan dua versi SoC telefon: 8 teras 2840MHz Qualcomm Snapdragon 855 vs. 8 teras 3000MHz MediaTek Dimensity 1300. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 855 Kelebihan

Lebar jalur memori yang lebih besar (34.13GB/s vs 34.1GB/s)

MediaTek Dimensity 1300 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.8985 TFLOPS )

Tinggi Frekuensi (3000MHz vs 2840MHz)

Proses pembuatan yang lebih moden (6nm vs 7nm)

Dikeluarkan lewat 3 tahun dan 3 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 855

592031

MediaTek Dimensity 1300 +17%

698511

Geekbench 6 Single Core

Qualcomm Snapdragon 855

939

MediaTek Dimensity 1300 +33%

1252

Geekbench 6 Multi Core

Qualcomm Snapdragon 855

2855

MediaTek Dimensity 1300 +21%

3457

FP32 (float)

Qualcomm Snapdragon 855

898

MediaTek Dimensity 1300 +9%

979

Qualcomm Snapdragon 855

VS

MediaTek Dimensity 1300

CPU

1x 2.84 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

Seni bina

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

2840 MHz

Frekuensi

3000 MHz

8

Teras

8

1 MB

Cache L2

-

0

Cache L3

-

7 nm

Proses

6 nm

6.7

Bilangan transistor

-

6 W

TDP

-

TSMC

Pembuatan

TSMC

Grafik

Adreno 640

Nama GPU

Mali-G77 MP9

585 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

9

384

Unit pewarnaan

64

16

Saiz maks

16

0.8985 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR4X

Jenis memori

LPDDR4X

2133 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

4x 16 Bit

34.13 Gbit/s

Lebar jalur maks

34.1 Gbit/s

AI

Hexagon 690

Pemproses neural (NPU)

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 690

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 3.0

Jenis storan

UFS 3.1

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 192MP, 2x 22MP

Resolusi kamera maks

1x 200MP

4K at 120FPS

Rakaman video

4K at 60FPS

8K at 30FPS, 4K at 120FPS

Main balik video

4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X24 LTE, X50 5G

Modem

Helio M70

Kesambungan

LTE Cat. 20

Sokongan 4G

LTE Cat. 19

Yes

Sokongan 5G

Yes

Up to 5000 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 1240 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.0

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Dis 2018

Diumumkan

Mac 2022

Flagship

Kelas

Flagship

SM8150

Nombor model

MT6893Z

Qualcomm Snapdragon 855

Halaman rasmi

MediaTek Dimensity 1300

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