Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 7050

VS

Qualcomm Snapdragon 865 Plus

MediaTek Dimensity 7050

Kami membandingkan dua versi SoC telefon: 8 teras 3100MHz Qualcomm Snapdragon 865 Plus vs. 8 teras 2600MHz MediaTek Dimensity 7050. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 865 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.3721 TFLOPS vs 0.686 TFLOPS )

Tinggi Frekuensi (3100MHz vs 2600MHz)

MediaTek Dimensity 7050 Kelebihan

Proses pembuatan yang lebih moden (6nm vs 7nm)

Penggunaan kuasa lebih rendah (4W berbanding 5W)

Dikeluarkan lewat 2 tahun dan 10 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 865 Plus +48%

796278

MediaTek Dimensity 7050

535270

Geekbench 6 Single Core

Qualcomm Snapdragon 865 Plus +20%

1163

MediaTek Dimensity 7050

962

Geekbench 6 Multi Core

Qualcomm Snapdragon 865 Plus +39%

3306

MediaTek Dimensity 7050

2364

FP32 (float)

Qualcomm Snapdragon 865 Plus +100%

1372

MediaTek Dimensity 7050

686

Qualcomm Snapdragon 865 Plus

VS

MediaTek Dimensity 7050

CPU

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

3100 MHz

Frekuensi

2600 MHz

8

Teras

8

ARMv8.2-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

-

0

Cache L3

-

7 nm

Proses

6 nm

10.3

Bilangan transistor

-

5 W

TDP

4 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G68 MP4

670 MHz

Frekuensi GPU

800 MHz

2

Unit pelaksanaan

4

512

Unit pewarnaan

-

16

Saiz maks

16

1.3721 TFLOPS

FLOPS

0.686 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

-

Memori

LPDDR5

Jenis memori

LPDDR5

2750 MHz

Frekuensi memori

3200 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

-

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

MediaTek APU 550

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 200MP

8K at 30FPS, 4K at 60FPS

Rakaman video

4K at 30FPS

8K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC, AIFF, CAF, MP3, MP4, WAV

X55

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 2770 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jul 2020

Diumumkan

Mei 2023

Flagship

Kelas

Mid range

SM8250-AB

Nombor model

MT6877 MT6877V/TTZA

Qualcomm Snapdragon 865 Plus

Halaman rasmi

MediaTek Dimensity 7050

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3

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Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 9200

5

Qualcomm Snapdragon 865 Plus vs MediaTek Helio G100

6

Qualcomm Snapdragon 865 Plus vs Apple A16 Bionic

7

Qualcomm Snapdragon 865 Plus vs Samsung Exynos 9611

8

Qualcomm Snapdragon 865 Plus vs Apple A13 Bionic

9

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 6 Gen 1

10

Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 810