Qualcomm Snapdragon 870 vs Mediatek Dimensity 9300

VS

Qualcomm Snapdragon 870 Mediatek Dimensity 9300

Kami membandingkan dua versi SoC telefon: 8 teras 3200MHz Qualcomm Snapdragon 870 vs. 8 teras 3250MHz Mediatek Dimensity 9300. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Mediatek Dimensity 9300 Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (5.9904 TFLOPS vs 1.3721 TFLOPS )

Lebar jalur memori yang lebih besar (76.8GB/s vs 44GB/s)

Tinggi Frekuensi (3250MHz vs 3200MHz)

Proses pembuatan yang lebih moden (4nm vs 7nm)

Dikeluarkan lewat 2 tahun dan 10 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 870

810488

Mediatek Dimensity 9300 +155%

2073613

Geekbench 6 Single Core

Qualcomm Snapdragon 870

1151

Mediatek Dimensity 9300 +93%

2225

Geekbench 6 Multi Core

Qualcomm Snapdragon 870

3336

Mediatek Dimensity 9300 +135%

7857

FP32 (float)

Qualcomm Snapdragon 870

1372

Mediatek Dimensity 9300 +336%

5990

Qualcomm Snapdragon 870

VS

Mediatek Dimensity 9300

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Seni bina

1x 3.25 GHz – Cortex-X4
3x 2.85 GHz – Cortex-X4
4x 2 GHz – Cortex-A720

3200 MHz

Frekuensi

3250 MHz

8

Teras

8

1 MB

Cache L2

-

0

Cache L3

0

7 nm

Proses

4 nm

10.3

Bilangan transistor

22.7

6 W

TDP

-

TSMC

Pembuatan

TSMC

Grafik

Adreno 650

Nama GPU

Mali-G720 Immortalis MP12

670 MHz

Frekuensi GPU

1300 MHz

2

Unit pelaksanaan

-

512

Unit pewarnaan

-

16

Saiz maks

24

1.3721 TFLOPS

FLOPS

5.9904 TFLOPS

1.1

Versi Vulkan

-

2.0

Versi OpenCL

-

12.1

Versi DirectX

-

Memori

LPDDR5

Jenis memori

LPDDR5T

2750 MHz

Frekuensi memori

9600 MHz

4x 16 Bit

Bas

4x 16 Bit

44 Gbit/s

Lebar jalur maks

76.8 Gbit/s

AI

Hexagon 698

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Hexagon 698

Pemproses neural (NPU)

Yes

UFS 3.0, UFS 3.1

Jenis storan

UFS 4.0

3840 x 2160

Resolusi paparan maks

2960 x 1440

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 320MP

8K at 30FPS, 4K at 60FPS

Rakaman video

8K at 30FPS, 4K at 60FPS

Main balik video

8K at 30FPS, 4K at 60FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X55

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 24

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 10000 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 7000 Mbps

6

Wi-Fi

7

5.2

Bluetooth

5.4

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jan 2021

Diumumkan

Nov 2023

Flagship

Kelas

Flagship

SM8250-AC

Nombor model

-

Qualcomm Snapdragon 870

Halaman rasmi

Mediatek Dimensity 9300

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 7s Gen 2 vs Qualcomm Snapdragon 870

2

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 3

3

Samsung Exynos 1380 vs Qualcomm Snapdragon 870

4

Qualcomm Snapdragon 7 Gen 3 vs Qualcomm Snapdragon 870

5

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 8 Gen 1

6

MediaTek Dimensity 7050 vs Qualcomm Snapdragon 870

7

MediaTek Helio G99 vs Qualcomm Snapdragon 870

8

Qualcomm Snapdragon 8 Gen 3 vs Mediatek Dimensity 9300

9

Qualcomm Snapdragon 870 vs Qualcomm Snapdragon 778G

10

Qualcomm Snapdragon 870 vs MediaTek Helio G88