Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 720

VS

Qualcomm Snapdragon 888 Plus

MediaTek Dimensity 720

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2000MHz MediaTek Dimensity 720. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.3264 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 17.07GB/s)

Tinggi Frekuensi (2995MHz vs 2000MHz)

Proses pembuatan yang lebih moden (5nm vs 7nm)

Penggunaan kuasa lebih rendah (8W berbanding 10W)

Dikeluarkan lewat 11 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +113%

836957

MediaTek Dimensity 720

391528

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +58%

1230

MediaTek Dimensity 720

774

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +103%

3778

MediaTek Dimensity 720

1861

FP32 (float)

Qualcomm Snapdragon 888 Plus +468%

1853

MediaTek Dimensity 720

326

Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 720

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

2x 2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

2995 MHz

Frekuensi

2000 MHz

8

Teras

8

ARMv8.4-A

Set arahan

ARMv8.2-A

1 MB

Cache L2

-

0

Cache L3

-

5 nm

Proses

7 nm

10.3

Bilangan transistor

-

8 W

TDP

10 W

Samsung

Pembuatan

-

Grafik

Adreno 660

Nama GPU

Mali-G57 MP3

905 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

3

512

Unit pewarnaan

64

24

Saiz maks

12

1.8534 TFLOPS

FLOPS

0.3264 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

2x 16 Bit

51.2 Gbit/s

Lebar jalur maks

17.07 Gbit/s

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

Yes

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.2

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 64MP, 2x 20MP

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 30FPS

8K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 2770 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Jun 2021

Diumumkan

Jul 2020

Flagship

Kelas

Mid range

SM8350-AC

Nombor model

MT6853V

Qualcomm Snapdragon 888 Plus

Halaman rasmi

MediaTek Dimensity 720

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Qualcomm Snapdragon 888 Plus vs Unisoc T606

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