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MediaTek Dimensity 8100 Max

MediaTek Dimensity 8100 Max
这是一款采用了 0nm工艺的处理器，上市时间为0001年1月。采用了核心设计，频率为0，集成了核显。

排行榜

[纠错]
Geekbench 6 单核
Qualcomm Snapdragon 778G Plus
Qualcomm Snapdragon 778G Plus 8C @ 2500 MHz
1069
MediaTek Dimensity 7030
MediaTek Dimensity 7030 8C @ 2500 MHz
1051
Qualcomm Snapdragon 780G
Qualcomm Snapdragon 780G 8C @ 2400 MHz
1045
MediaTek Dimensity 7300
MediaTek Dimensity 7300 8C @ 2500 MHz
1043
MediaTek Dimensity 1000 Plus
MediaTek Dimensity 1000 Plus 8C @ 2600 MHz
1040
Qualcomm Snapdragon 855 Plus
Qualcomm Snapdragon 855 Plus 8C @ 2960 MHz
1040
MediaTek Dimensity 7025
MediaTek Dimensity 7025 8C @ 2500 MHz
1024
Geekbench 6 多核
Qualcomm Snapdragon 870
Qualcomm Snapdragon 870 8C @ 3200 MHz
3336
Samsung Exynos 2100
Samsung Exynos 2100 8C @ 2900 MHz
3334
MediaTek Dimensity 1100
MediaTek Dimensity 1100 8C @ 2600 MHz
3332
Qualcomm Snapdragon 865 Plus
Qualcomm Snapdragon 865 Plus 8C @ 3100 MHz
3306
Qualcomm Snapdragon 865
Qualcomm Snapdragon 865 8C @ 2840 MHz
3277
HiSilicon Kirin 9000E
HiSilicon Kirin 9000E 8C @ 3130 MHz
3255
MediaTek Dimensity 8050
MediaTek Dimensity 8050 8C @ 3000 MHz
3242

相关对比

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MediaTek Dimensity 8100 Max vs Qualcomm Snapdragon 7s Gen 3
3
MediaTek Dimensity 8100 Max vs HiSilicon Kirin 990
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