Intel Core i9 13900HK vs Qualcomm Snapdragon X Plus

VS

Intel Core i9 13900HK

Qualcomm Snapdragon X Plus

We compared two laptop CPUs: Intel Core i9 13900HK with 14 cores 2.6GHz and Qualcomm Snapdragon X Plus with 10 cores 3.4GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

Intel Core i9 13900HK 's Advantages

Newer PCIe version (5.0 vs 4.0)

Qualcomm Snapdragon X Plus 's Advantages

Released 1 years and 3 months late

Better graphics card performance

Higher specification of memory (8448 vs 6400)

Larger memory bandwidth (135GB/s vs 89.6GB/s)

Higher base frequency (3.4GHz vs 2.6GHz)

Larger L3 cache size (42MB vs 24MB)

More modern manufacturing process (4nm vs 10nm)

Lower TDP (23W vs 45W)

Score

Benchmark

Cinebench R23 Single Core

Intel Core i9 13900HK +30%

1944

Qualcomm Snapdragon X Plus

1488

Cinebench R23 Multi Core

Intel Core i9 13900HK +74%

20855

Qualcomm Snapdragon X Plus

11931

Geekbench 6 Single Core

Intel Core i9 13900HK +21%

2841

Qualcomm Snapdragon X Plus

2347

Geekbench 6 Multi Core

Intel Core i9 13900HK +14%

14855

Qualcomm Snapdragon X Plus

12973

Cinebench 2024 Single Core

Intel Core i9 13900HK +5%

115

Qualcomm Snapdragon X Plus

109

Cinebench 2024 Multi Core

Intel Core i9 13900HK +16%

987

Qualcomm Snapdragon X Plus

845

Blender

Intel Core i9 13900HK

262

Qualcomm Snapdragon X Plus +37%

360

Passmark CPU Single Core

Intel Core i9 13900HK +23%

3968

Qualcomm Snapdragon X Plus

3208

Passmark CPU Multi Core

Intel Core i9 13900HK +44%

31334

Qualcomm Snapdragon X Plus

21685

Intel Core i9 13900HK

VS

Qualcomm Snapdragon X Plus

General Parameters

Jan 2023

Release Date

Apr 2024

Intel

Manufacturer

Qualcomm

Laptop

Type

Laptop

x86-64

Instruction Set

ARMv9

Raptor Lake

Core Architecture

Snapdragon X

i9-13900HK

Processor Number

X1P-64-100

BGA-1744

Socket

Custom

Iris Xe Graphics (96EU)

Integrated Graphics

Qualcomm Adreno X1

-

Generation

Oryon

Package

10 nm

Manufacturing Process

4 nm

35-45 W

Power Consumption

23 W

115 W

Max Turbo Power Consumption

80 W

100°C

Peak Operating Temperature

-

Foundry

Samsung TSMC

-

Die Size

mm²

CPU Performance

6

Performance Cores

10

12

Performance Core Threads

10

2.6 GHz

Performance Core Base Frequency

3.4 GHz

5.4 GHz

Performance Core Turbo Frequency

3.4 GHz

8

Efficiency Cores

-

8

Efficiency Core Threads

-

1.9 GHz

Efficiency Core Base Frequency

-

4.1 GHz

Efficiency Core Turbo Frequency

-

14

Total Core Count

10

20

Total Thread Count

10

100 MHz

Bus Frequency

100 MHz

26x

Multiplier

34x

80 K per core

L1 Cache

-

2 MB per core

L2 Cache

-

24 MB shared

L3 Cache

42 MB

Yes

Unlocked Multiplier

No

-

SMP

1

Memory Parameters

DDR5-5200, DDR4-3200, LPDDR5-6400, LPDDR5x-6400, LPDDR4x-4267

Memory Types

LPDDR5X-8448

96 GB

Max Memory Size

64 GB

2

Max Memory Channels

8

89.6 GB/s

Max Memory Bandwidth

135 GB/s

No

ECC Memory Support

No

Graphics Card Parameters

true

Integrated Graphics

true

300 MHz

GPU Base Frequency

500 MHz

1500 MHz

GPU Max Dynamic Frequency

1200 MHz

768

Shader Units

1536

48

Texture Units

48

24

Raster Operation Units

6

96

Execution Units

6

15 W

Power Consumption

1.69 TFLOPS

Graphics Performance

3.8 TFLOPS

Miscellaneous

Intel Core i9 13900HK

Official Website

Qualcomm Snapdragon X Plus

5.0

PCIe Version

4.0

28

PCIe Lanes

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