Home Comparison Qualcomm Snapdragon X Plus vs Intel Core Ultra 9 285H

Qualcomm Snapdragon X Plus vs Intel Core Ultra 9 285H

We compared two laptop CPUs: Qualcomm Snapdragon X Plus with 10 cores 3.4GHz and Intel Core Ultra 9 285H with 16 cores 2.9GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

Qualcomm Snapdragon X Plus 's Advantages
Higher specification of memory (8448 vs 8400)
Larger memory bandwidth (135GB/s vs 102.4GB/s)
Higher base frequency (3.4GHz vs 2.9GHz)
Larger L3 cache size (42MB vs 24MB)
Lower TDP (23W vs 45W)
Intel Core Ultra 9 285H 's Advantages
Released 9 months late
Better graphics card performance
Newer PCIe version (5.0 vs 4.0)
More modern manufacturing process (3nm vs 4nm)

Score

Benchmark

Cinebench R23 Single Core
Qualcomm Snapdragon X Plus
1488
Intel Core Ultra 9 285H +39%
2074
Cinebench R23 Multi Core
Qualcomm Snapdragon X Plus
11931
Intel Core Ultra 9 285H +86%
22192
Geekbench 6 Single Core
Qualcomm Snapdragon X Plus
2347
Intel Core Ultra 9 285H +30%
3073
Geekbench 6 Multi Core
Qualcomm Snapdragon X Plus
12973
Intel Core Ultra 9 285H +36%
17644
Cinebench 2024 Single Core
Qualcomm Snapdragon X Plus
109
Intel Core Ultra 9 285H +18%
129
Cinebench 2024 Multi Core
Qualcomm Snapdragon X Plus
845
Intel Core Ultra 9 285H +36%
1154
Blender
Qualcomm Snapdragon X Plus +83%
360
Intel Core Ultra 9 285H
196
Passmark CPU Single Core
Qualcomm Snapdragon X Plus
3208
Intel Core Ultra 9 285H +39%
4481
Passmark CPU Multi Core
Qualcomm Snapdragon X Plus
21685
Intel Core Ultra 9 285H +53%
33267

General Parameters

Apr 2024
Release Date
Jan 2025
Qualcomm
Manufacturer
Intel
Laptop
Type
Laptop
ARMv9
Instruction Set
x86-64
Snapdragon X
Core Architecture
Arrow Lake
X1P-64-100
Processor Number
285H
Custom
Socket
FCBGA-2049
Qualcomm Adreno X1
Integrated Graphics
Arc Graphics 140T
Oryon
Generation
-

Package

4 nm
Manufacturing Process
3 nm
23 W
Power Consumption
35-45 W
80 W
Max Turbo Power Consumption
115 W
Peak Operating Temperature
110 °C
Samsung TSMC
Foundry
-
mm²
Die Size
-

CPU Performance

10
Performance Cores
6
10
Performance Core Threads
6
3.4 GHz
Performance Core Base Frequency
2.9 GHz
3.4 GHz
Performance Core Turbo Frequency
5.4 GHz
-
Efficiency Cores
10
-
Efficiency Core Threads
10
-
Efficiency Core Base Frequency
2.7 GHz
-
Efficiency Core Turbo Frequency
4.5 GHz
10
Total Core Count
16
10
Total Thread Count
16
100 MHz
Bus Frequency
100 MHz
34x
Multiplier
29
-
L1 Cache
112 K per core
-
L2 Cache
2 MB per core
42 MB
L3 Cache
24 MB shared
No
Unlocked Multiplier
No
1
SMP
-

Memory Parameters

LPDDR5X-8448
Memory Types
LPDDR5-8400,LPDDR5x-8400,DDR5-6400
64 GB
Max Memory Size
128 GB
8
Max Memory Channels
2
135 GB/s
Max Memory Bandwidth
102.4 GB/s
No
ECC Memory Support
No

Graphics Card Parameters

true
Integrated Graphics
true
500 MHz
GPU Base Frequency
300 MHz
1200 MHz
GPU Max Dynamic Frequency
2350 MHz
1536
Shader Units
1024
48
Texture Units
64
6
Raster Operation Units
32
6
Execution Units
8
Power Consumption
35
3.8 TFLOPS
Graphics Performance
4.8 TFLOPS

Miscellaneous

4.0
PCIe Version
5.0
PCIe Lanes
28
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