Home Comparison Qualcomm Snapdragon X Plus vs Intel Core i9 13900HX

Qualcomm Snapdragon X Plus vs Intel Core i9 13900HX

We compared two laptop CPUs: Qualcomm Snapdragon X Plus with 10 cores 3.4GHz and Intel Core i9 13900HX with 24 cores 2.2GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

Qualcomm Snapdragon X Plus 's Advantages
Released 1 years and 3 months late
Better graphics card performance
Higher specification of memory (8448 vs 5600)
Larger memory bandwidth (135GB/s vs 89.6GB/s)
Higher base frequency (3.4GHz vs 2.2GHz)
Larger L3 cache size (42MB vs 36MB)
More modern manufacturing process (4nm vs 10nm)
Lower TDP (23W vs 55W)
Intel Core i9 13900HX 's Advantages
Newer PCIe version (5.0 vs 4.0)

Score

Benchmark

Cinebench R23 Single Core
Qualcomm Snapdragon X Plus
1488
Intel Core i9 13900HX +39%
2069
Cinebench R23 Multi Core
Qualcomm Snapdragon X Plus
11931
Intel Core i9 13900HX +147%
29473
Geekbench 6 Single Core
Qualcomm Snapdragon X Plus
2347
Intel Core i9 13900HX +20%
2826
Geekbench 6 Multi Core
Qualcomm Snapdragon X Plus
12973
Intel Core i9 13900HX +29%
16799
Cinebench 2024 Single Core
Qualcomm Snapdragon X Plus
109
Intel Core i9 13900HX +5%
115
Cinebench 2024 Multi Core
Qualcomm Snapdragon X Plus
845
Intel Core i9 13900HX +97%
1672
Blender
Qualcomm Snapdragon X Plus
360
Intel Core i9 13900HX +33%
482
Passmark CPU Single Core
Qualcomm Snapdragon X Plus
3208
Intel Core i9 13900HX +29%
4154
Passmark CPU Multi Core
Qualcomm Snapdragon X Plus
21685
Intel Core i9 13900HX +105%
44610
VS

General Parameters

Apr 2024
Release Date
Jan 2023
Qualcomm
Manufacturer
Intel
Laptop
Type
Laptop
ARMv9
Instruction Set
x86-64
Snapdragon X
Core Architecture
Raptor Lake
X1P-64-100
Processor Number
i9-13900HX
Custom
Socket
BGA-1964
Qualcomm Adreno X1
Integrated Graphics
UHD Graphics (32EU)
Oryon
Generation
-

Package

4 nm
Manufacturing Process
10 nm
23 W
Power Consumption
45-55 W
80 W
Max Turbo Power Consumption
157 W
Peak Operating Temperature
100°C
Samsung TSMC
Foundry
-
mm²
Die Size
-

CPU Performance

10
Performance Cores
8
10
Performance Core Threads
16
3.4 GHz
Performance Core Base Frequency
2.2 GHz
3.4 GHz
Performance Core Turbo Frequency
5.4 GHz
-
Efficiency Cores
16
-
Efficiency Core Threads
16
-
Efficiency Core Base Frequency
1.6 GHz
-
Efficiency Core Turbo Frequency
3.9 GHz
10
Total Core Count
24
10
Total Thread Count
32
100 MHz
Bus Frequency
100 MHz
34x
Multiplier
22x
-
L1 Cache
80 K per core
-
L2 Cache
2 MB per core
42 MB
L3 Cache
36 MB shared
No
Unlocked Multiplier
Yes
1
SMP
-

Memory Parameters

LPDDR5X-8448
Memory Types
DDR5-5600, DDR4-3200
64 GB
Max Memory Size
192 GB
8
Max Memory Channels
2
135 GB/s
Max Memory Bandwidth
89.6 GB/s
No
ECC Memory Support
Yes

Graphics Card Parameters

true
Integrated Graphics
true
500 MHz
GPU Base Frequency
300 MHz
1200 MHz
GPU Max Dynamic Frequency
1650 MHz
1536
Shader Units
256
48
Texture Units
16
6
Raster Operation Units
8
6
Execution Units
32
Power Consumption
45 W
3.8 TFLOPS
Graphics Performance
0.74 TFLOPS

Miscellaneous

4.0
PCIe Version
5.0
PCIe Lanes
20

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