Home Comparison Qualcomm Snapdragon X Plus X1P 64 100 vs AMD Ryzen AI 9 HX 370

Qualcomm Snapdragon X Plus X1P 64 100 vs AMD Ryzen AI 9 HX 370

Qualcomm Snapdragon X Plus X1P 64 100
VS
AMD Ryzen AI 9 HX 370
Qualcomm Snapdragon X Plus (X1P-64-100)
AMD Ryzen AI 9 HX 370
We compared two laptop CPUs: Qualcomm Snapdragon X Plus X1P 64 100 with 10 cores 3.4GHz and AMD Ryzen AI 9 HX 370 with 12 cores 2.0GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

Qualcomm Snapdragon X Plus X1P 64 100 's Advantages
Higher specification of memory (8448 vs 7500)
Larger memory bandwidth (135GB/s vs 89.6GB/s)
Higher base frequency (3.4GHz vs 2.0GHz)
Larger L3 cache size (42MB vs 24MB)
Lower TDP (23W vs 54W)
AMD Ryzen AI 9 HX 370 's Advantages
Better graphics card performance

Score

Benchmark

Cinebench R23 Single Core
Qualcomm Snapdragon X Plus X1P 64 100
1469
AMD Ryzen AI 9 HX 370 +38%
2034
Cinebench R23 Multi Core
Qualcomm Snapdragon X Plus X1P 64 100
11764
AMD Ryzen AI 9 HX 370 +102%
23784
Geekbench 6 Single Core
Qualcomm Snapdragon X Plus X1P 64 100
2347
AMD Ryzen AI 9 HX 370 +22%
2870
Geekbench 6 Multi Core
Qualcomm Snapdragon X Plus X1P 64 100
12970
AMD Ryzen AI 9 HX 370 +16%
15121
Cinebench 2024 Single Core
Qualcomm Snapdragon X Plus X1P 64 100
108
AMD Ryzen AI 9 HX 370 +14%
124
Cinebench 2024 Multi Core
Qualcomm Snapdragon X Plus X1P 64 100
837
AMD Ryzen AI 9 HX 370 +35%
1130
Passmark CPU Single Core
Qualcomm Snapdragon X Plus X1P 64 100
3208
AMD Ryzen AI 9 HX 370 +25%
4010
Passmark CPU Multi Core
Qualcomm Snapdragon X Plus X1P 64 100
21700
AMD Ryzen AI 9 HX 370 +62%
35258
Qualcomm Snapdragon X Plus X1P 64 100
VS
AMD Ryzen AI 9 HX 370

General Parameters

Apr 2024
Release Date
Jun 2024
Qualcomm
Manufacturer
Amd
Laptop
Type
Laptop
ARMv9
Instruction Set
x86-64
Snapdragon X
Core Architecture
Zen 5 (Strix Point)
X1P-64-100
Processor Number
-
Custom
Socket
FP8
Qualcomm Adreno X1
Integrated Graphics
Radeon 890M
-
Generation
Ryzen AI 300 Series

Package

-
Transistor Count
4 nm
Manufacturing Process
4 nm
23 W
Power Consumption
15-54 W
-
Max Turbo Power Consumption
W
-
Peak Operating Temperature
100 °C
-
Foundry
TSMC
-
I/O Process Size
6 nm

CPU Performance

10
Performance Cores
4
10
Performance Core Threads
8
3.4 GHz
Performance Core Base Frequency
2.0 GHz
-
Performance Core Turbo Frequency
5.1 GHz
-
Efficiency Cores
8
-
Efficiency Core Threads
16
-
Efficiency Core Base Frequency
2.0 GHz
-
Efficiency Core Turbo Frequency
3.3 GHz
10
Total Core Count
12
10
Total Thread Count
24
-
Bus Frequency
100 MHz
34x
Multiplier
20
-
L1 Cache
80 K per core
-
L2 Cache
1 MB per core
42 MB
L3 Cache
24 MB shared
No
Unlocked Multiplier
No
-
SMP
1

Memory Parameters

LPDDR5X-8448
Memory Types
DDR5-5600,LPDDR5X-7500
64 GB
Max Memory Size
256 GB
8
Max Memory Channels
2
135 GB/s
Max Memory Bandwidth
89.6 GB/s
No
ECC Memory Support
No

Graphics Card Parameters

true
Integrated Graphics
true
500 MHz
GPU Base Frequency
800 MHz
1200 MHz
GPU Max Dynamic Frequency
2900 MHz
1536
Shader Units
1024
48
Texture Units
64
6
Raster Operation Units
40
6
Execution Units
16
-
Power Consumption
15
-
Max Resolution
7680x4320 - 60 Hz
3.8 TFLOPS
Graphics Performance
5.94 TFLOPS

AI Accelerator

Qualcomm Hexagon NPU
NPU
AMD Ryzen™ AI
45 TOPS
Theoretical performance
50 TOPS

Miscellaneous

Qualcomm Snapdragon X Plus X1P 64 100
Official Website
AMD Ryzen AI 9 HX 370
4.0
PCIe Version
4.0
-
PCIe Lanes
16

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