Home Intel Atom Intel Atom x7211RE

Intel Atom x7211RE

Intel Atom x7211RE
This is a processor manufactured by Intel using the 10nm fabrication process, designed for Server platform, released on Apr 2024. It features a design of 2 cores to achieve 2 cores and 2 threads, with specification. The base frequency is 1GHz, with a maximum turbo boost frequency of 3.2GHz,TDP of 6W, L3 cache up to 6 MB.with integrated graphics.It uses the Intel BGA 1264 socket.

General Parameters

[Report Issues]
Release Date
Apr 2024
Manufacturer
Intel
Type
Server
Core Architecture
Amston Lake
Integrated Graphics
UHD Graphics 16EU
Generation
Atom (Gracemont)

Package

[Report Issues]
Manufacturing Process
10 nm
Socket
Intel BGA 1264
Power Consumption
6 W
Foundry
Intel
Package
FC-BGA16F

CPU Performance

[Report Issues]
Performance Core Base Frequency
1 GHz
Performance Core Turbo Frequency
3.2 GHz
Total Core Count
2
Total Thread Count
2
Bus Frequency
100 MHz
Multiplier
10.0
L1 Cache
96 KB per core
L2 Cache
2 MB shared
L3 Cache
6 MB shared
Unlocked Multiplier
No
SMP
1

Memory Parameters

[Report Issues]
Memory Types
DDR4-3200, DDR5-4800
Max Memory Size
16 GB
Max Memory Channels
1
Max Memory Bandwidth
38.4 GB/s
ECC Memory Support
No

Miscellaneous

[Report Issues]
Official Website
Intel Atom x7211RE
PCIe Version
3
PCIe Lanes
9

Related Comparisons

1
Intel Xeon Phi 3110X vs Intel Atom x7211RE
2
Intel Atom x7211RE vs Intel Xeon E5 2697 v2
3
Intel Atom x7211RE vs Intel Xeon w9 3475X
4
Intel Atom x7211RE vs Intel Xeon E5 2697 v3
5
Intel Atom x7211RE vs Opteron X2 180
6
Intel Atom x7211RE vs Intel Xeon E5503
7
Intel Xeon w3 2425 vs Intel Atom x7211RE
8
Intel Atom x7211RE vs Xeon W 1370P
9
Intel Atom x7211RE vs Intel Xeon Platinum 8592V
10
Intel Atom x7211RE vs Opteron 2216 HE (F3)

Related News

1
Researchers Utilize NVIDIA Omniverse Platform to Analyze and Improve 3D Stacked Chip Designs
2
TSMC to Receive Over 60 EUV Lithography Machines Over the Next Two Years, Investing More Than $12.3 Billion
3
NVIDIA Grace CPU Benchmark Results Released, Stunning Performance
4
AMD's Commitment to Pioneering Each Generation with Cutting-Edge Process Technology and Continuous Innovation in Design, Packaging, and Assembly
5
TSMC Explores Advanced Chip Packaging Technology: Switches to Rectangular Substrate, Nearly Tripling Usable Area on 300mm Wafers
© 2024 - TopCPU.net   Contact Us Privacy Policy