MSI has officially released a BIOS update based on AGESA version 1.2.0.1 microcode for its X670 and B650 series motherboards. This update enables support for a 105W TDP mode when paired with the Zen5-family's Ryzen 9 7900X and Ryzen 7 7700X, unlocking greater performance potential.
After applying the BIOS update, the default thermal design power consumption for both processors remains at 65W. However, users can manually unlock it to 105W.
Measurements indicate that CineBench R23 multi-core performance can increase by up to 13%, although this will also result in a slight rise in power consumption and heat generation.
The first batch of supported motherboard models includes:
Next-generation 800 series motherboards will support this feature by default.
The good news is that this feature does not affect the warranty!
However, it is still in beta. The official version will be implemented in the AGESA 1.2.0.2 microcode, when all motherboard manufacturers will push the 105W mode.
