CPU
GPU
SoC
Categories
Rankings
CPU Rankings
GPU Rankings
SoC Rankings
English
English
Close menu
Home
CPU
GPU
SoC
Categories
CPU Rankings
GPU Rankings
SoC Rankings
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
中文
English
Español
Deutsch
Français
Italiano
Português
日本語
한국어
العربية
ภาษาไทย
繁體中文
Tiếng Việt
Bahasa Melayu
Home
Mobile and Tablet SoC Comparison
Google Tensor G2 vs Qualcomm Snapdragon 888
Google Tensor G2 vs Qualcomm Snapdragon 888
VS
Google Tensor G2
Qualcomm Snapdragon 888
We compared two versions of phone SoCs: 8 cores 2850MHz Google Tensor G2 vs. 8 cores 2840MHz Qualcomm Snapdragon 888 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
Google Tensor G2 Advantages
Higher Frequency (2850MHz vs 2840MHz)
Lower TDP (7W vs 10W)
Released 1 years and 10 months late
Qualcomm Snapdragon 888 Advantages
Better graphics card performance FLOPS (1.72 TFLOPS vs 1.1424 TFLOPS )
Score
Benchmark
Geekbench 6 Single Core
Google Tensor G2
1188
Qualcomm Snapdragon 888
+24%
1481
Geekbench 6 Multi Core
Google Tensor G2
3468
Qualcomm Snapdragon 888
+9%
3794
FP32 (float)
Google Tensor G2
1142
Qualcomm Snapdragon 888
+50%
1720
Google Tensor G2
VS
Qualcomm Snapdragon 888
CPU
2x 2.85 GHz – Cortex-X1
2x 2.35 GHz – Cortex-A78
4x 1.8 GHz – Cortex-A55
Architecture
1x 2.84 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
2850 MHz
Frequency
2840 MHz
8
Cores
8
-
L2 cache
1 MB
0
L3 cache
0
5 nm
Process
5 nm
7 W
TDP
10 W
Samsung
Manufacturing
-
Graphics
Mali-G710 MP7
GPU name
Adreno 660
850 MHz
GPU frequency
840 MHz
7
Execution units
2
96
Shading units
512
16
Max size
24
1.1424 TFLOPS
FLOPS
1.72 TFLOPS
-
Vulkan version
1.1
-
OpenCL version
2.0
-
DirectX version
12
Memory
LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
3200 MHz
4x 16 Bit
Bus
4x 16 Bit
51.2 Gbit/s
Max bandwidth
51.2 Gbit/s
AI
Next-gen Tensor Processing Unit
NPU
Hexagon 780
Multimedia (ISP)
Next-gen Tensor Processing Unit
Neural processor (NPU)
Hexagon 780
UFS 3.1
Storage type
UFS 3.0, UFS 3.1
3840 x 2160
Max display resolution
3840 x 2160
1x 200MP, 2x 32MP
Max camera resolution
1x 200MP, 2x 25MP
4K at 60FPS
Video capture
8K at 30FPS, 4K at 120FPS
4K at 60FPS
Video playback
8K at 30FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP8, VP9
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Exynos 5300g
Modem
X60
Connectivity
LTE Cat. 24
4G support
LTE Cat. 22
Yes
5G support
是
Up to 7350 Mbps
Download speed
Up to 2500 Mbps
Up to 3670 Mbps
Upload speed
Up to 316 Mbps
6
Wi-Fi
6
5.2
Bluetooth
5.2
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Oct 2022
Announced
Dec 2020
Flagship
Class
Flagship
-
Model number
SM8350
-
Official page
Qualcomm Snapdragon 888
Related SoC Comparison
1
Samsung Exynos 1480 vs Google Tensor G2
2
Google Tensor G3 vs Google Tensor G2
3
Google Tensor G2 vs Qualcomm Snapdragon 7 Gen 3
4
Google Tensor G2 vs Qualcomm Snapdragon 7s Gen 2
5
Qualcomm Snapdragon 6 Gen 1 vs Google Tensor G2
6
MediaTek Dimensity 8300 vs Google Tensor G2
7
Samsung Exynos 1480 vs Qualcomm Snapdragon 888
8
Qualcomm Snapdragon 888 vs Qualcomm Snapdragon 7s Gen 2
9
Google Tensor G2 vs Qualcomm Snapdragon 782G
10
Google Tensor G2 vs MediaTek Dimensity 6080
Related News
1
AMD's Strix Halo Supports Up to 128GB Memory, Clearly Designed for AI Large Language Models
2
AMD to Launch Advanced Ryzen AI PRO Series Soon
3
Intel Delays Lunar Lake Shipment: Postponed from June to September
4
Initial Test Results of AMD Ryzen AI 9 365 Revealed: IPC Improvement Meets Expectations
5
Elon Musk Responds to Nvidia’s Jensen Huang: Humanoid Robots Will Be Ten Times More Common than Cars
6
AMD Revives Multi-GPU Support: Up to Four Cards and 192GB VRAM
7
TSMC Explores Advanced Chip Packaging Technology: Switches to Rectangular Substrate, Nearly Tripling Usable Area on 300mm Wafers
8
Western Digital WD Blue SN5000 SSD Launched: Up to 8TB Capacity with Mixed TLC/QLC Flash
9
Apple's Most Powerful Laptop is Coming: A Preview of the New MacBook Pro
10
AMD Breakthrough: Ryzen AI HX 370 Processor Benchmark Revealed with Aggressive Performance
© 2024 - TopCPU.net
Contact Us
Privacy Policy