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Mobile and Tablet SoC Comparison
HiSilicon Kirin 659 vs Qualcomm Snapdragon 888
HiSilicon Kirin 659 vs Qualcomm Snapdragon 888
VS
HiSilicon Kirin 659
Qualcomm Snapdragon 888
We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 659 vs. 8 cores 2840MHz Qualcomm Snapdragon 888 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
Qualcomm Snapdragon 888 Advantages
Better graphics card performance FLOPS (1.72 TFLOPS vs 0.0576 TFLOPS )
Higher Frequency (2840MHz vs 2360MHz)
More modern manufacturing process (5nm vs 16nm)
Released 3 years and 11 months late
Score
Benchmark
Geekbench 6 Single Core
HiSilicon Kirin 659
215
Qualcomm Snapdragon 888
+588%
1481
Geekbench 6 Multi Core
HiSilicon Kirin 659
810
Qualcomm Snapdragon 888
+368%
3794
FP32 (float)
HiSilicon Kirin 659
57
Qualcomm Snapdragon 888
+2917%
1720
HiSilicon Kirin 659
VS
Qualcomm Snapdragon 888
CPU
4x 2.36 GHz – Cortex-A53
4x 1.7 GHz – Cortex-A53
Architecture
1x 2.84 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
2360 MHz
Frequency
2840 MHz
8
Cores
8
ARMv8-A
Instruction set
ARMv8.4-A
-
L2 cache
1 MB
-
L3 cache
0
16 nm
Process
5 nm
4
Transistor count
-
-
TDP
10 W
Graphics
Mali-T830 MP2
GPU name
Adreno 660
900 MHz
GPU frequency
840 MHz
2
Execution units
2
16
Shading units
512
4
Max size
24
0.0576 TFLOPS
FLOPS
1.72 TFLOPS
1.0
Vulkan version
1.1
1.2
OpenCL version
2.0
11
DirectX version
12
Memory
LPDDR3
Memory type
LPDDR5
933 MHz
Memory frequency
3200 MHz
2x 32 Bit
Bus
4x 16 Bit
-
Max bandwidth
51.2 Gbit/s
Multimedia (ISP)
No
Neural processor (NPU)
Hexagon 780
eMMC 5.1
Storage type
UFS 3.0, UFS 3.1
1920 x 1200
Max display resolution
3840 x 2160
1x 16MP, 2x 8MP
Max camera resolution
1x 200MP, 2x 25MP
1K at 60FPS
Video capture
8K at 30FPS, 4K at 120FPS
1080p at 60FPS
Video playback
8K at 30FPS
H.264, H.265
Video codecs
H.264, H.265, VP8, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Modem
X60
Connectivity
LTE Cat. 7
4G support
LTE Cat. 22
No
5G support
是
Up to 300 Mbps
Download speed
Up to 2500 Mbps
Up to 50 Mbps
Upload speed
Up to 316 Mbps
4
Wi-Fi
6
4.2
Bluetooth
5.2
GPS, GLONASS, Beidou
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Jan 2017
Announced
Dec 2020
Mid range
Class
Flagship
Hi6250
Model number
SM8350
-
Official page
Qualcomm Snapdragon 888
Related SoC Comparison
1
HiSilicon Kirin 659 vs Mediatek Helio P60
2
HiSilicon Kirin 659 vs MediaTek Dimensity 820
3
HiSilicon Kirin 659 vs MediaTek Helio G81
4
HiSilicon Kirin 659 vs Qualcomm Snapdragon 8 Gen 2
5
HiSilicon Kirin 659 vs Qualcomm Snapdragon 845
6
HiSilicon Kirin 659 vs Qualcomm Snapdragon 865
7
HiSilicon Kirin 659 vs Qualcomm Snapdragon 480
8
HiSilicon Kirin 659 vs Qualcomm Snapdragon 710
9
HiSilicon Kirin 659 vs Qualcomm Snapdragon 8 Gen 3
10
HiSilicon Kirin 659 vs HiSilicon Kirin 9010
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