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Mobile and Tablet SoC Comparison
HiSilicon Kirin 710 vs MediaTek Dimensity 8300
HiSilicon Kirin 710 vs MediaTek Dimensity 8300
VS
HiSilicon Kirin 710
MediaTek Dimensity 8300
We compared two versions of phone SoCs: 8 cores 2200MHz HiSilicon Kirin 710 vs. 8 cores 3350MHz MediaTek Dimensity 8300 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 8300 Advantages
Higher Frequency (3350MHz vs 2200MHz)
More modern manufacturing process (4nm vs 12nm)
Released 5 years and 4 months late
Score
Benchmark
AnTuTu 10
HiSilicon Kirin 710
202054
MediaTek Dimensity 8300
+666%
1549153
Geekbench 6 Single Core
HiSilicon Kirin 710
356
MediaTek Dimensity 8300
+323%
1506
Geekbench 6 Multi Core
HiSilicon Kirin 710
1197
MediaTek Dimensity 8300
+304%
4844
HiSilicon Kirin 710
VS
MediaTek Dimensity 8300
CPU
4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
Architecture
1x 3.35 GHz – Cortex-A715
3x 3.2 GHz – Cortex-A715
4x 2.2 GHz – Cortex-A510
2200 MHz
Frequency
3350 MHz
8
Cores
8
ARMv8-A
Instruction set
ARMv9-A
512 KB
L2 cache
-
0
L3 cache
0
12 nm
Process
4 nm
5.5
Transistor count
-
5 W
TDP
-
TSMC
Manufacturing
TSMC
Graphics
Mali-G51 MP4
GPU name
Mali-G615 MP6
1000 MHz
GPU frequency
1400 MHz
4
Execution units
6
16
Shading units
-
6
Max size
24
0.128 TFLOPS
FLOPS
-
1.3
Vulkan version
1.3
2.0
OpenCL version
2.0
12
DirectX version
-
Memory
LPDDR4X
Memory type
LPDDR5X
1866 MHz
Memory frequency
4266 MHz
2x 32 Bit
Bus
4x 16 Bit
-
Max bandwidth
68.2 Gbit/s
Multimedia (ISP)
No
Neural processor (NPU)
MediaTek APU 780
eMMC 5.1, UFS 2.1
Storage type
UFS 4.0
2340 x 1080
Max display resolution
2960 x 1440
1x 40MP, 2x 24MP
Max camera resolution
1x 320MP
1K at 30FPS
Video capture
4K at 60FPS
1080p at 60FPS
Video playback
4K at 60FPS
H.264, H.265, VP8, VP9
Video codecs
H.264, H.265, AV1, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Connectivity
LTE Cat. 12
4G support
-
No
5G support
Yes
Up to 600 Mbps
Download speed
Up to 7900 Mbps
Up to 150 Mbps
Upload speed
Up to 4200 Mbps
4
Wi-Fi
6
4.2
Bluetooth
5.4
GPS, GLONASS, Beidou, Galileo
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Jul 2018
Announced
Nov 2023
Mid range
Class
Flagship
Hi6260
Model number
-
HiSilicon Kirin 710
Official page
MediaTek Dimensity 8300
Related SoC Comparison
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HiSilicon Kirin 710 vs Unisoc Tiger T615
2
HiSilicon Kirin 710 vs Qualcomm Snapdragon 652
3
HiSilicon Kirin 710 vs Unisoc SC9863A
4
HiSilicon Kirin 710 vs MediaTek Dimensity 9000
5
HiSilicon Kirin 710 vs Qualcomm Snapdragon 780G
6
HiSilicon Kirin 710 vs Samsung Exynos 9820
7
HiSilicon Kirin 710 vs HiSilicon Kirin 990 5G
8
HiSilicon Kirin 710 vs Qualcomm Snapdragon 888 Plus
9
HiSilicon Kirin 710 vs MediaTek Helio G100
10
HiSilicon Kirin 710 vs MediaTek Dimensity 8200
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