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Mobile and Tablet SoC Comparison
HiSilicon Kirin 710F vs Qualcomm Snapdragon 855
HiSilicon Kirin 710F vs Qualcomm Snapdragon 855
VS
HiSilicon Kirin 710F
Qualcomm Snapdragon 855
We compared two versions of phone SoCs: 8 cores 2200MHz HiSilicon Kirin 710F vs. 8 cores 2840MHz Qualcomm Snapdragon 855 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
HiSilicon Kirin 710F Advantages
Lower TDP (5W vs 6W)
Qualcomm Snapdragon 855 Advantages
Better graphics card performance FLOPS (0.8985 TFLOPS vs 0.128 TFLOPS )
Higher Frequency (2840MHz vs 2200MHz)
More modern manufacturing process (7nm vs 12nm)
Score
Benchmark
AnTuTu 10
HiSilicon Kirin 710F
251754
Qualcomm Snapdragon 855
+135%
592031
Geekbench 6 Single Core
HiSilicon Kirin 710F
355
Qualcomm Snapdragon 855
+164%
939
Geekbench 6 Multi Core
HiSilicon Kirin 710F
1255
Qualcomm Snapdragon 855
+127%
2855
FP32 (float)
HiSilicon Kirin 710F
128
Qualcomm Snapdragon 855
+601%
898
HiSilicon Kirin 710F
VS
Qualcomm Snapdragon 855
CPU
4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
Architecture
1x 2.84 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)
2200 MHz
Frequency
2840 MHz
8
Cores
8
ARMv8-A
Instruction set
ARMv8.2-A
512 KB
L2 cache
1 MB
0
L3 cache
0
12 nm
Process
7 nm
5.5
Transistor count
6.7
5 W
TDP
6 W
TSMC
Manufacturing
TSMC
Graphics
Mali-G51 MP4
GPU name
Adreno 640
1000 MHz
GPU frequency
585 MHz
4
Execution units
2
16
Shading units
384
8
Max size
16
0.128 TFLOPS
FLOPS
0.8985 TFLOPS
1.3
Vulkan version
1.1
2.0
OpenCL version
2.0
12
DirectX version
12.1
Memory
LPDDR4X
Memory type
LPDDR4X
1866 MHz
Memory frequency
2133 MHz
2x 32 Bit
Bus
4x 16 Bit
-
Max bandwidth
34.13 Gbit/s
Multimedia (ISP)
No
Neural processor (NPU)
Hexagon 690
eMMC 5.1, UFS 2.1
Storage type
UFS 3.0
2340 x 1080
Max display resolution
3840 x 2160
1x 48MP, 2x 24MP
Max camera resolution
1x 192MP, 2x 22MP
1K at 30FPS
Video capture
4K at 120FPS
1080p at 60FPS
Video playback
8K at 30FPS, 4K at 120FPS
H.264, H.265, VP8, VP9
Video codecs
H.264, H.265, VP8, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Modem
X24 LTE, X50 5G
Connectivity
LTE Cat. 12
4G support
LTE Cat. 20
No
5G support
Yes
Up to 600 Mbps
Download speed
Up to 5000 Mbps
Up to 150 Mbps
Upload speed
Up to 1240 Mbps
4
Wi-Fi
6
4.2
Bluetooth
5.0
GPS, GLONASS, Beidou, Galileo
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS
Info
Jan 2019
Announced
Dec 2018
Mid range
Class
Flagship
-
Model number
SM8150
-
Official page
Qualcomm Snapdragon 855
Related SoC Comparison
1
HiSilicon Kirin 710F vs Samsung Exynos 850
2
HiSilicon Kirin 710F vs Qualcomm Snapdragon 7s Gen 3
3
HiSilicon Kirin 710F vs Qualcomm Snapdragon 670
4
HiSilicon Kirin 710F vs MediaTek Dimensity 1000L
5
HiSilicon Kirin 710F vs Qualcomm Snapdragon 710
6
HiSilicon Kirin 710F vs MediaTek Dimensity 9300 Plus
7
HiSilicon Kirin 710F vs Samsung Exynos 980
8
HiSilicon Kirin 710F vs Qualcomm Snapdragon 7 Gen 3
9
HiSilicon Kirin 710F vs Samsung Exynos 2100
10
HiSilicon Kirin 710F vs Unisoc Tiger T618
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