HiSilicon Kirin 960 vs Qualcomm Snapdragon 865 Plus

VS

HiSilicon Kirin 960

Qualcomm Snapdragon 865 Plus

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 960 vs. 8 cores 3100MHz Qualcomm Snapdragon 865 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 865 Plus Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.2655 TFLOPS )

Larger memory bandwidth (44GB/s vs 28.8GB/s)

Higher Frequency (3100MHz vs 2360MHz)

More modern manufacturing process (7nm vs 16nm)

Released 3 years and 9 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 960

278916

Qualcomm Snapdragon 865 Plus +185%

796278

Geekbench 6 Single Core

HiSilicon Kirin 960

408

Qualcomm Snapdragon 865 Plus +185%

1163

Geekbench 6 Multi Core

HiSilicon Kirin 960

1385

Qualcomm Snapdragon 865 Plus +138%

3306

FP32 (float)

HiSilicon Kirin 960

265

Qualcomm Snapdragon 865 Plus +417%

1372

HiSilicon Kirin 960

VS

Qualcomm Snapdragon 865 Plus

CPU

4x 2.36 GHz – Cortex-A73
4x 1.84 GHz – Cortex-A53

Architecture

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

2360 MHz

Frequency

3100 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8.2-A

4 MB

L2 cache

1 MB

-

L3 cache

0

16 nm

Process

7 nm

4

Transistor count

10.3

5 W

TDP

5 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G71 MP8

GPU name

Adreno 650

1037 MHz

GPU frequency

670 MHz

8

Execution units

2

16

Shading units

512

4

Max size

16

0.2655 TFLOPS

FLOPS

1.3721 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

11.3

DirectX version

12.1

Memory

LPDDR4

Memory type

LPDDR5

1600 MHz

Memory frequency

2750 MHz

2x 32 Bit

Bus

4x 16 Bit

28.8 Gbit/s

Max bandwidth

44 Gbit/s

Multimedia (ISP)

No

Neural processor (NPU)

Hexagon 698

eMMC 5.1, UFS 2.1

Storage type

UFS 3.0, UFS 3.1

2560 x 1600

Max display resolution

3840 x 2160

2x 16MP

Max camera resolution

1x 200MP, 2x 25MP

4K at 30FPS

Video capture

8K at 30FPS, 4K at 60FPS

4K at 30FPS

Video playback

8K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

X55

Connectivity

LTE Cat. 12

4G support

LTE Cat. 22

No

5G support

Yes

Up to 600 Mbps

Download speed

Up to 7500 Mbps

Up to 150 Mbps

Upload speed

Up to 3000 Mbps

5

Wi-Fi

6

4.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

Oct 2016

Announced

Jul 2020

Flagship

Class

Flagship

Hi3660

Model number

SM8250-AB

-

Official page

Qualcomm Snapdragon 865 Plus

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