HiSilicon Kirin 970 vs Qualcomm Snapdragon 480 Plus

VS

HiSilicon Kirin 970

Qualcomm Snapdragon 480 Plus

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 2200MHz Qualcomm Snapdragon 480 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

HiSilicon Kirin 970 Advantages

Larger memory bandwidth (29.8GB/s vs 17GB/s)

Higher Frequency (2360MHz vs 2200MHz)

Qualcomm Snapdragon 480 Plus Advantages

Better graphics card performance FLOPS (0.4864 TFLOPS vs 0.3318 TFLOPS )

More modern manufacturing process (8nm vs 10nm)

Lower TDP (3W vs 9W)

Released 4 years and 1 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970

355946

Qualcomm Snapdragon 480 Plus +2%

363972

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 480 Plus +124%

866

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 480 Plus +35%

1859

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 480 Plus +46%

486

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 480 Plus

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

2x 2.2 GHz – Kryo 460 Gold (Cortex-A76)
6x 1.8 GHz – Kryo 460 Silver (Cortex-A55)

2360 MHz

Frequency

2200 MHz

8

Cores

8

ARMv8-A

Instruction set

ARMv8-A

2 MB

L2 cache

-

0

L3 cache

-

10 nm

Process

8 nm

5.5

Transistor count

-

9 W

TDP

3 W

TSMC

Manufacturing

Samsung

Graphics

Mali-G72 MP12

GPU name

Adreno 619

768 MHz

GPU frequency

950 MHz

12

Execution units

2

18

Shading units

128

8

Max size

8

0.3318 TFLOPS

FLOPS

0.4864 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR4X

1866 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

2x 16 Bit

29.8 Gbit/s

Max bandwidth

17 Gbit/s

Multimedia (ISP)

Yes

Neural processor (NPU)

Hexagon 686

UFS 2.1

Storage type

eMMC 5.1, UFS 2.2

3120 x 1440

Max display resolution

2520 x 1080

1x 48MP, 2x 20MP

Max camera resolution

1x 64MP, 2x 25MP

4K at 30FPS

Video capture

1K at 60FPS

4K at 30FPS

Video playback

1080p at 60FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AIFF, CAF, MP3, MP4, WAV

-

Modem

Snapdragon X51

Connectivity

LTE Cat. 18

4G support

LTE Cat. 18

No

5G support

Yes

Up to 1200 Mbps

Download speed

Up to 2500 Mbps

Up to 150 Mbps

Upload speed

Up to 800 Mbps

5

Wi-Fi

5

4.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Sep 2017

Announced

Oct 2021

Flagship

Class

Low end

Hi3670

Model number

SM4350-AC

HiSilicon Kirin 970

Official page

Qualcomm Snapdragon 480 Plus

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