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Mobile and Tablet SoC Comparison
MediaTek Dimensity 1300 vs HiSilicon Kirin 650
MediaTek Dimensity 1300 vs HiSilicon Kirin 650
VS
MediaTek Dimensity 1300
HiSilicon Kirin 650
We compared two versions of phone SoCs: 8 cores 3000MHz MediaTek Dimensity 1300 vs. 8 cores 2000MHz HiSilicon Kirin 650 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 1300 Advantages
Better graphics card performance FLOPS (0.9792 TFLOPS vs 0.0576 TFLOPS )
Higher Frequency (3000MHz vs 2000MHz)
More modern manufacturing process (6nm vs 16nm)
Released 6 years and 2 months late
Score
Benchmark
FP32 (float)
MediaTek Dimensity 1300
+1617%
979
HiSilicon Kirin 650
57
MediaTek Dimensity 1300
VS
HiSilicon Kirin 650
CPU
1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
Architecture
4x 2 GHz – Cortex-A53
4x 1.7 GHz – Cortex-A53
3000 MHz
Frequency
2000 MHz
8
Cores
8
6 nm
Process
16 nm
-
Transistor count
4
-
TDP
5 W
TSMC
Manufacturing
-
Graphics
Mali-G77 MP9
GPU name
Mali-T830 MP2
850 MHz
GPU frequency
900 MHz
9
Execution units
2
64
Shading units
16
16
Max size
4
0.9792 TFLOPS
FLOPS
0.0576 TFLOPS
1.3
Vulkan version
1.0
2.0
OpenCL version
1.2
12
DirectX version
11
Memory
LPDDR4X
Memory type
LPDDR3
2133 MHz
Memory frequency
933 MHz
4x 16 Bit
Bus
2x 32 Bit
34.1 Gbit/s
Max bandwidth
-
AI
MediaTek APU 3.0
NPU
No
Multimedia (ISP)
MediaTek APU 3.0
Neural processor (NPU)
No
UFS 3.1
Storage type
eMMC 5.1
2520 x 1080
Max display resolution
1920 x 1200
1x 200MP
Max camera resolution
1x 16MP, 2x 8MP
4K at 60FPS
Video capture
1K at 60FPS
4K at 60FPS
Video playback
1080p at 60FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Helio M70
Modem
-
Connectivity
LTE Cat. 19
4G support
LTE Cat. 7
Yes
5G support
No
Up to 4700 Mbps
Download speed
Up to 300 Mbps
Up to 2500 Mbps
Upload speed
Up to 50 Mbps
6
Wi-Fi
4
5.2
Bluetooth
4.1
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou
Info
Mar 2022
Announced
Jan 2016
Flagship
Class
Mid range
MT6893Z
Model number
Hi6250
MediaTek Dimensity 1300
Official page
HiSilicon Kirin 650
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9
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