MediaTek Dimensity 6300 vs HiSilicon Kirin 710

VS

MediaTek Dimensity 6300

HiSilicon Kirin 710

We compared two versions of phone SoCs: 8 cores 2400MHz MediaTek Dimensity 6300 vs. 8 cores 2200MHz HiSilicon Kirin 710 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 6300 Advantages

Higher Frequency (2400MHz vs 2200MHz)

More modern manufacturing process (6nm vs 12nm)

Released 5 years and 9 months late

Score

Benchmark

AnTuTu 10

MediaTek Dimensity 6300 +121%

447617

HiSilicon Kirin 710

202054

MediaTek Dimensity 6300

VS

HiSilicon Kirin 710

CPU

2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

Architecture

4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53

2400 MHz

Frequency

2200 MHz

8

Cores

8

ARMv8.2-A

Instruction set

ARMv8-A

-

L2 cache

512 KB

-

L3 cache

0

6 nm

Process

12 nm

-

Transistor count

5.5

-

TDP

5 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G57 MP2

GPU name

Mali-G51 MP4

-

GPU frequency

1000 MHz

2

Execution units

4

64

Shading units

16

12

Max size

6

-

FLOPS

0.128 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

-

DirectX version

12

Memory

LPDDR4X

Memory type

LPDDR4X

2133 MHz

Memory frequency

1866 MHz

2x 16 Bit

Bus

2x 32 Bit

17.07 Gbit/s

Max bandwidth

-

AI

Yes

NPU

-

Multimedia (ISP)

Yes

Neural processor (NPU)

No

UFS 2.2

Storage type

eMMC 5.1, UFS 2.1

2520 x 1080

Max display resolution

2340 x 1080

1x 108MP, 2x 16MP

Max camera resolution

1x 40MP, 2x 24MP

2K at 30FPS

Video capture

1K at 30FPS

2K at 30FPS

Video playback

1080p at 60FPS

H.264, H.265, VP9

Video codecs

H.264, H.265, VP8, VP9

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Audio codecs

AIFF, CAF, MP3, MP4, WAV

Connectivity

-

4G support

LTE Cat. 12

Yes

5G support

No

Up to 3300 Mbps

Download speed

Up to 600 Mbps

-

Upload speed

Up to 150 Mbps

5

Wi-Fi

4

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Apr 2024

Announced

Jul 2018

Mid range

Class

Mid range

-

Model number

Hi6260

MediaTek Dimensity 6300

Official page

HiSilicon Kirin 710

Related SoC Comparison

1

MediaTek Dimensity 6300 vs Samsung Exynos 2200

2

MediaTek Dimensity 6300 vs Unisoc T820

3

MediaTek Dimensity 6300 vs Samsung Exynos 9820

4

MediaTek Dimensity 6300 vs HiSilicon Kirin 970

5

MediaTek Dimensity 6300 vs MediaTek Helio G90

6

MediaTek Dimensity 6300 vs Qualcomm Snapdragon 765

7

MediaTek Dimensity 6300 vs MediaTek Dimensity 800U

8

MediaTek Dimensity 6300 vs MediaTek Dimensity 8300

9

MediaTek Dimensity 6300 vs Qualcomm Snapdragon 8 Plus Gen 1

10

MediaTek Dimensity 6300 vs MediaTek Dimensity 800