Home MediaTek Dimensity 6300

MediaTek Dimensity 6300

MediaTek Dimensity 6300
This is a processor manufactured using the TSMC 6nm process, announced on Apr 2024. It features 8 cores, operates at a frequency of 2400MHz, and integrates the Mali-G57 MP2 GPU.

CPU

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Architecture
2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Frequency
2400 MHz
Cores
8
Instruction set
ARMv8.2-A
Process
6 nm
Manufacturing
TSMC

Graphics

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GPU name
Mali-G57 MP2
Execution units
2
Shading units
64
Vulkan version
1.3
OpenCL version
2.0

Memory

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Memory type
LPDDR4X
Memory frequency
2133 MHz
Bus
2x 16 Bit
Max bandwidth
17.07 Gbit/s

AI

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NPU
Yes

Multimedia (ISP)

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Neural processor (NPU)
Yes
Storage type
UFS 2.2
Max display resolution
2520 x 1080
Max camera resolution
1x 108MP, 2x 16MP
Video capture
2K at 30FPS
Video playback
2K at 30FPS
Video codecs
H.264, H.265, VP9
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Connectivity

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5G support
Yes
Download speed
Up to 3300 Mbps
Wi-Fi
5
Bluetooth
5.2
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

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Announced
Apr 2024
Class
Mid range
Official page

Rankings

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AnTuTu 10
MediaTek Dimensity 930
465671
Unisoc T760
Unisoc T760 8C @ 2200 MHz
450189
Qualcomm Snapdragon 845
448489
MediaTek Dimensity 6300
447617
MediaTek Dimensity 6400
446033
MediaTek Helio G200
MediaTek Helio G200 8C @ 2200 MHz
444826
Qualcomm Snapdragon 750G
441755
Geekbench 6 Single Core
HiSilicon Kirin 980
HiSilicon Kirin 980 8C @ 2600 MHz
835
Samsung Exynos 1080
Samsung Exynos 1080 8C @ 2800 MHz
822
MediaTek Dimensity 6300
813
MediaTek Dimensity 6400
803
Qualcomm Snapdragon 765G
801
Qualcomm Snapdragon 690
797
MediaTek Dimensity 810
787
Geekbench 6 Multi Core
Unisoc T8300
Unisoc T8300 8C @ 2200 MHz
2209
Apple A10X Fusion
Apple A10X Fusion 6C @ 2380 MHz
2201
MediaTek Dimensity 6400
2159
MediaTek Dimensity 6300
2135
Qualcomm Snapdragon 695
2134
HiSilicon Kirin 980
HiSilicon Kirin 980 8C @ 2600 MHz
2132
Qualcomm Snapdragon 4 Gen 2
2128
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