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Mobile and Tablet SoC Comparison
MediaTek Dimensity 8400 vs HiSilicon Kirin 810
MediaTek Dimensity 8400 vs HiSilicon Kirin 810
VS
MediaTek Dimensity 8400
HiSilicon Kirin 810
We compared two versions of phone SoCs: 8 cores 3250MHz MediaTek Dimensity 8400 vs. 8 cores 2270MHz HiSilicon Kirin 810 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
MediaTek Dimensity 8400 Advantages
Larger memory bandwidth (136GB/s vs 31.78GB/s)
Higher Frequency (3250MHz vs 2270MHz)
More modern manufacturing process (4nm vs 7nm)
Released 5 years and 6 months late
Score
Benchmark
Geekbench 6 Single Core
MediaTek Dimensity 8400
+112%
1651
HiSilicon Kirin 810
778
Geekbench 6 Multi Core
MediaTek Dimensity 8400
+243%
6833
HiSilicon Kirin 810
1992
MediaTek Dimensity 8400
VS
HiSilicon Kirin 810
CPU
1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
Architecture
2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55
3250 MHz
Frequency
2270 MHz
8
Cores
8
ARMv9-A
Instruction set
ARMv8.2-A
3.5 MB
L2 cache
1 MB
6 MB
L3 cache
-
4 nm
Process
7 nm
-
Transistor count
6.9
-
TDP
5 W
TSMC
Manufacturing
-
Graphics
Mali-G720 MC7
GPU name
Mali-G52 MP6
1400 MHz
GPU frequency
820 MHz
6
Execution units
6
-
Shading units
24
24
Max size
8
-
FLOPS
0.2362 TFLOPS
1.3
Vulkan version
1.3
2.0
OpenCL version
2.0
-
DirectX version
12
Memory
LPDDR5X
Memory type
LPDDR4X
8533 MHz
Memory frequency
2133 MHz
4x 16 Bit
Bus
4x 16 Bit
136 Gbit/s
Max bandwidth
31.78 Gbit/s
AI
MediaTek NPU 880
NPU
-
Multimedia (ISP)
MediaTek NPU 880
Neural processor (NPU)
Yes
UFS 4.0
Storage type
eMMC 5.1, UFS 2.1
2960 x 1440
Max display resolution
3840 x 2160
1x 320MP
Max camera resolution
1x 48MP, 2x 20MP
4K at 60FPS
Video capture
1K at 30FPS
4K at 60FPS
Video playback
1080p at 60FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Connectivity
-
4G support
LTE Cat. 12
Yes
5G support
No
Up to 7900 Mbps
Download speed
Up to 600 Mbps
Up to 4200 Mbps
Upload speed
Up to 150 Mbps
6
Wi-Fi
6
5.4
Bluetooth
5.0
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo
Info
Dec 2024
Announced
Jun 2019
Flagship
Class
Mid range
-
Model number
Hi6280
MediaTek Dimensity 8400
Official page
HiSilicon Kirin 810
Related SoC Comparison
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2
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3
MediaTek Dimensity 8400 vs MediaTek Dimensity 8050
4
MediaTek Dimensity 8400 vs HiSilicon Kirin 950
5
MediaTek Dimensity 8400 vs MediaTek Dimensity 1000L
6
MediaTek Dimensity 8400 vs MediaTek Dimensity 1100
7
MediaTek Dimensity 8400 vs MediaTek Dimensity 1000 Plus
8
MediaTek Dimensity 8400 vs Qualcomm Snapdragon 625
9
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10
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