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MediaTek Dimensity 8400
MediaTek Dimensity 8400
This is a processor manufactured using the TSMC 4nm process, announced on Dec 2024. It features 8 cores, operates at a frequency of 3250MHz, with a level 3 cache of 6MB, and integrates the Mali-G720 MC7 GPU.
CPU
[Report Issues]
Architecture
1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
Frequency
3250 MHz
Cores
8
Instruction set
ARMv9-A
L2 cache
3.5 MB
L3 cache
6 MB
Process
4 nm
Manufacturing
TSMC
Graphics
[Report Issues]
GPU name
Mali-G720 MC7
GPU frequency
1400 MHz
Execution units
6
Vulkan version
1.3
OpenCL version
2.0
Memory
[Report Issues]
Memory type
LPDDR5X
Memory frequency
8533 MHz
Bus
4x 16 Bit
Max bandwidth
136 Gbit/s
AI
[Report Issues]
NPU
MediaTek NPU 880
Multimedia (ISP)
[Report Issues]
Neural processor (NPU)
MediaTek NPU 880
Storage type
UFS 4.0
Max display resolution
2960 x 1440
Max camera resolution
1x 320MP
Video capture
4K at 60FPS
Video playback
4K at 60FPS
Video codecs
H.264, H.265, AV1, VP9
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Connectivity
[Report Issues]
5G support
Yes
Download speed
Up to 7900 Mbps
Upload speed
Up to 4200 Mbps
Wi-Fi
6
Bluetooth
5.4
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
[Report Issues]
Announced
Dec 2024
Class
Flagship
Official page
MediaTek Dimensity 8400
Rankings
[Report Issues]
Geekbench 6 Single Core
Qualcomm Snapdragon 8 Plus Gen 1
8C @ 3200 MHz
1665
Qualcomm Snapdragon 8 Gen 1
8C @ 3000 MHz
1664
MediaTek Dimensity 9000 Plus
8C @ 3200 MHz
1654
MediaTek Dimensity 8400
8C @ 3250 MHz
1651
HiSilicon Kirin 9020
8C @ 2500 MHz
1616
MediaTek Dimensity 9000
8C @ 3050 MHz
1599
Samsung Exynos 2200
8C @ 2800 MHz
1594
Geekbench 6 Multi Core
Qualcomm Snapdragon 8 Gen 3
8C @ 3300 MHz
7250
Samsung Exynos 2400
10C @ 3210 MHz
6920
Apple A16 Bionic
6C @ 3460 MHz
6838
MediaTek Dimensity 8400
8C @ 3250 MHz
6833
Samsung Exynos 2400e
10C @ 3110 MHz
6414
Apple A15 Bionic
6C @ 3230 MHz
5741
Google Tensor G5
8C @ 3400 MHz
5712
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MediaTek Dimensity 8400 vs MediaTek Dimensity 800
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