Qualcomm Snapdragon 7 Plus Gen 3 vs MediaTek Dimensity 9300 Plus

VS

Qualcomm Snapdragon 7 Plus Gen 3 MediaTek Dimensity 9300 Plus

We compared two versions of phone SoCs: 8 cores 2800MHz Qualcomm Snapdragon 7 Plus Gen 3 vs. 8 cores 3400MHz MediaTek Dimensity 9300 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 9300 Plus Advantages

Better graphics card performance FLOPS (5.9904 TFLOPS vs 2.9184 TFLOPS )

Larger memory bandwidth (76.8GB/s vs 64GB/s)

Higher Frequency (3400MHz vs 2800MHz)

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 7 Plus Gen 3

1366982

MediaTek Dimensity 9300 Plus +68%

2305267

Geekbench 6 Single Core

Qualcomm Snapdragon 7 Plus Gen 3

1913

MediaTek Dimensity 9300 Plus +20%

2302

Geekbench 6 Multi Core

Qualcomm Snapdragon 7 Plus Gen 3

5098

MediaTek Dimensity 9300 Plus +48%

7547

FP32 (float)

Qualcomm Snapdragon 7 Plus Gen 3

2918

MediaTek Dimensity 9300 Plus +105%

5990

Qualcomm Snapdragon 7 Plus Gen 3

VS

MediaTek Dimensity 9300 Plus

CPU

1x 2.8 GHz – Cortex-X4
4x 2.6 GHz – Cortex-A720
3x 1.9 GHz – Cortex-A520

Architecture

1x 3.4 GHz – Cortex-X4
3x 2.85 GHz – Cortex-X4
4x 2 GHz – Cortex-A720

2800 MHz

Frequency

3400 MHz

8

Cores

8

-

L2 cache

1 MB

12 MB

L3 cache

0

4 nm

Process

4 nm

-

Transistor count

22.7

8 W

TDP

-

TSMC

Manufacturing

TSMC

Graphics

Adreno 732

GPU name

Mali-G720 Immortalis MP12

950 MHz

GPU frequency

1300 MHz

2

Execution units

12

768

Shading units

192

24

Max size

24

2.9184 TFLOPS

FLOPS

5.9904 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

-

Memory

LPDDR5X

Memory type

LPDDR5T

4200 MHz

Memory frequency

4800 MHz

4x 16 Bit

Bus

4x 16 Bit

64 Gbit/s

Max bandwidth

76.8 Gbit/s

AI

Yes

NPU

MediaTek APU 790

Multimedia (ISP)

Yes

Neural processor (NPU)

MediaTek APU 790

UFS 4.0

Storage type

UFS 4.0

3840 x 2160

Max display resolution

3840 x 2160

1x 200MP

Max camera resolution

1x 320MP

4K at 60FPS

Video capture

8K at 30FPS, 4K at 60FPS

4K at 60FPS

Video playback

8K at 30FPS, 4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Snapdragon X63 5G

Modem

MediaTek T830

Connectivity

LTE Cat. 18

4G support

LTE Cat. 24

Yes

5G support

Yes

Up to 5000 Mbps

Download speed

Up to 7900 Mbps

Up to 3500 Mbps

Upload speed

Up to 4200 Mbps

7

Wi-Fi

7

5.4

Bluetooth

5.4

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Mar 2024

Announced

May 2024

Mid range

Class

Flagship

SM7675

Model number

-

Qualcomm Snapdragon 7 Plus Gen 3

Official page

MediaTek Dimensity 9300 Plus

Related SoC Comparison

1

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

2

Qualcomm Snapdragon 7 Plus Gen 3 vs MediaTek Dimensity 8200

3

Qualcomm Snapdragon 8s Gen 3 vs Qualcomm Snapdragon 7 Plus Gen 3

4

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 860

5

Qualcomm Snapdragon 7 Plus Gen 3 vs MediaTek Dimensity 8300

6

Qualcomm Snapdragon 7 Plus Gen 3 vs MediaTek Dimensity 8100

7

Qualcomm Snapdragon 8 Gen 2 vs Qualcomm Snapdragon 7 Plus Gen 3

8

MediaTek Dimensity 9300 Plus vs Qualcomm Snapdragon 8 Gen 3

9

Qualcomm Snapdragon 7 Plus Gen 3 vs HiSilicon Kirin 710

10

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 4 Gen 1

Related News

1

Initial Test Results of AMD Ryzen AI 9 365 Revealed: IPC Improvement Meets Expectations

2

Elon Musk Responds to Nvidia’s Jensen Huang: Humanoid Robots Will Be Ten Times More Common than Cars

3

AMD Revives Multi-GPU Support: Up to Four Cards and 192GB VRAM

4

TSMC Explores Advanced Chip Packaging Technology: Switches to Rectangular Substrate, Nearly Tripling Usable Area on 300mm Wafers

5

Western Digital WD Blue SN5000 SSD Launched: Up to 8TB Capacity with Mixed TLC/QLC Flash

6

Apple's Most Powerful Laptop is Coming: A Preview of the New MacBook Pro

7

AMD Breakthrough: Ryzen AI HX 370 Processor Benchmark Revealed with Aggressive Performance

8

Russian Cosplayer as Marika from 'Elden Ring': Stunning Figure in a High-Slit Gown

9

AMD Patents Multi-Chip Design GPU with Configurable Multi-Mode Capabilities

10

MSI Unveils Laptop with AMD Ryzen AI 300 Chip at Computex Taipei 2024