Qualcomm Snapdragon 778G vs HiSilicon Kirin 970

VS

Qualcomm Snapdragon 778G HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 2400MHz Qualcomm Snapdragon 778G vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 778G Advantages

Higher Frequency (2400MHz vs 2360MHz)

More modern manufacturing process (6nm vs 10nm)

Lower TDP (5W vs 9W)

Released 3 years and 8 months late

HiSilicon Kirin 970 Advantages

Larger memory bandwidth (29.8GB/s vs 25.6GB/s)

Score

Benchmark

Geekbench 6 Single Core

Qualcomm Snapdragon 778G +154%

981

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

Qualcomm Snapdragon 778G +102%

2787

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 778G

VS

HiSilicon Kirin 970

CPU

1x 2.4 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

2400 MHz

Frequency

2360 MHz

8

Cores

8

2 MB

L2 cache

2 MB

-

L3 cache

0

6 nm

Process

10 nm

-

Transistor count

5.5

5 W

TDP

9 W

-

Manufacturing

TSMC

Graphics

Adreno 642L

GPU name

Mali-G72 MP12

490 MHz

GPU frequency

768 MHz

2

Execution units

12

384

Shading units

18

16

Max size

8

-

FLOPS

0.3318 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

1866 MHz

2x 16 Bit

Bus

4x 16 Bit

25.6 Gbit/s

Max bandwidth

29.8 Gbit/s

AI

Hexagon 770

NPU

Yes

Multimedia (ISP)

Hexagon 770

Neural processor (NPU)

Yes

UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1

Storage type

UFS 2.1

2520 x 1080

Max display resolution

3120 x 1440

1x 192MP, 2x 36MP

Max camera resolution

1x 48MP, 2x 20MP

4K at 30FPS

Video capture

4K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

32 bit@384 kHz, HD-audio

X53

Modem

-

Connectivity

LTE Cat. 24

4G support

LTE Cat. 18

是

5G support

No

Up to 1200 Mbps

Download speed

Up to 1200 Mbps

Up to 210 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

May 2021

Announced

Sep 2017

Mid range

Class

Flagship

SM7325

Model number

Hi3670

Qualcomm Snapdragon 778G

Official page

HiSilicon Kirin 970

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