Qualcomm Snapdragon 855 Plus vs MediaTek Dimensity 1200

VS

Qualcomm Snapdragon 855 Plus

MediaTek Dimensity 1200

We compared two versions of phone SoCs: 8 cores 2960MHz Qualcomm Snapdragon 855 Plus vs. 8 cores 3000MHz MediaTek Dimensity 1200 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 855 Plus Advantages

Better graphics card performance FLOPS (1.0368 TFLOPS vs 0.9792 TFLOPS )

Larger memory bandwidth (34.13GB/s vs 34.1GB/s)

Lower TDP (6W vs 10W)

MediaTek Dimensity 1200 Advantages

Higher Frequency (3000MHz vs 2960MHz)

More modern manufacturing process (6nm vs 7nm)

Released 1 years and 6 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 855 Plus

552687

MediaTek Dimensity 1200 +30%

722511

Geekbench 6 Single Core

Qualcomm Snapdragon 855 Plus

1040

MediaTek Dimensity 1200 +7%

1118

Geekbench 6 Multi Core

Qualcomm Snapdragon 855 Plus

2865

MediaTek Dimensity 1200 +11%

3198

FP32 (float)

Qualcomm Snapdragon 855 Plus +5%

1036

MediaTek Dimensity 1200

979

Qualcomm Snapdragon 855 Plus

VS

MediaTek Dimensity 1200

CPU

1x 2.96 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

Architecture

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

2960 MHz

Frequency

3000 MHz

8

Cores

8

ARMv8.2-A

Instruction set

ARMv8.2-A

1 MB

L2 cache

320 KB

0

L3 cache

0

7 nm

Process

6 nm

6.7

Transistor count

-

6 W

TDP

10 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 640

GPU name

Mali-G77 MP9

675 MHz

GPU frequency

850 MHz

2

Execution units

9

384

Shading units

64

16

Max size

16

1.0368 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR4X

Memory type

LPDDR4X

2133 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

4x 16 Bit

34.13 Gbit/s

Max bandwidth

34.1 Gbit/s

Multimedia (ISP)

Hexagon 690

Neural processor (NPU)

MediaTek APU 3.0

UFS 3.0

Storage type

UFS 3.1

3840 x 2160

Max display resolution

2520 x 1080

1x 192MP, 2x 22MP

Max camera resolution

1x 200MP, 2x 32MP

4K at 120FPS

Video capture

4K at 60FPS

8K at 30FPS, 4K at 120FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X24 LTE, X50 5G

Modem

Helio M70

Connectivity

LTE Cat. 20

4G support

LTE Cat. 19

Yes

5G support

Yes

Up to 5000 Mbps

Download speed

Up to 4700 Mbps

Up to 1240 Mbps

Upload speed

Up to 2500 Mbps

6

Wi-Fi

6

5.0

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jul 2019

Announced

Jan 2021

Flagship

Class

Flagship

SM8150-AC

Model number

MT6893

Qualcomm Snapdragon 855 Plus

Official page

MediaTek Dimensity 1200

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