Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 1200

VS

Qualcomm Snapdragon 865 Plus

MediaTek Dimensity 1200

We compared two versions of phone SoCs: 8 cores 3100MHz Qualcomm Snapdragon 865 Plus vs. 8 cores 3000MHz MediaTek Dimensity 1200 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 865 Plus Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.9792 TFLOPS )

Larger memory bandwidth (44GB/s vs 34.1GB/s)

Higher Frequency (3100MHz vs 3000MHz)

Lower TDP (5W vs 10W)

MediaTek Dimensity 1200 Advantages

More modern manufacturing process (6nm vs 7nm)

Released 6 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 865 Plus +10%

796278

MediaTek Dimensity 1200

722511

Geekbench 6 Single Core

Qualcomm Snapdragon 865 Plus +4%

1163

MediaTek Dimensity 1200

1118

Geekbench 6 Multi Core

Qualcomm Snapdragon 865 Plus +3%

3306

MediaTek Dimensity 1200

3198

FP32 (float)

Qualcomm Snapdragon 865 Plus +40%

1372

MediaTek Dimensity 1200

979

Qualcomm Snapdragon 865 Plus

VS

MediaTek Dimensity 1200

CPU

1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Architecture

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

3100 MHz

Frequency

3000 MHz

8

Cores

8

ARMv8.2-A

Instruction set

ARMv8.2-A

1 MB

L2 cache

320 KB

0

L3 cache

0

7 nm

Process

6 nm

10.3

Transistor count

-

5 W

TDP

10 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 650

GPU name

Mali-G77 MP9

670 MHz

GPU frequency

850 MHz

2

Execution units

9

512

Shading units

64

16

Max size

16

1.3721 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

2750 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

4x 16 Bit

44 Gbit/s

Max bandwidth

34.1 Gbit/s

Multimedia (ISP)

Hexagon 698

Neural processor (NPU)

MediaTek APU 3.0

UFS 3.0, UFS 3.1

Storage type

UFS 3.1

3840 x 2160

Max display resolution

2520 x 1080

1x 200MP, 2x 25MP

Max camera resolution

1x 200MP, 2x 32MP

8K at 30FPS, 4K at 60FPS

Video capture

4K at 60FPS

8K at 30FPS

Video playback

4K at 60FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AIFF, CAF, MP3, MP4, WAV

X55

Modem

Helio M70

Connectivity

LTE Cat. 22

4G support

LTE Cat. 19

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 4700 Mbps

Up to 3000 Mbps

Upload speed

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jul 2020

Announced

Jan 2021

Flagship

Class

Flagship

SM8250-AB

Model number

MT6893

Qualcomm Snapdragon 865 Plus

Official page

MediaTek Dimensity 1200

Related SoC Comparison

1

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 690

2

Qualcomm Snapdragon 865 Plus vs Unisoc Tiger T612

3

Qualcomm Snapdragon 865 Plus vs MediaTek Helio G37

4

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 778G Plus

5

Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 1000

6

Qualcomm Snapdragon 865 Plus vs MediaTek Dimensity 6300

7

Qualcomm Snapdragon 865 Plus vs MediaTek Helio P35

8

Qualcomm Snapdragon 865 Plus vs Apple A12 Bionic

9

Qualcomm Snapdragon 865 Plus vs Samsung Exynos 2500

10

Qualcomm Snapdragon 865 Plus vs Qualcomm Snapdragon 675