Qualcomm Snapdragon 870 vs HiSilicon Kirin 970

VS

Qualcomm Snapdragon 870

HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 3200MHz Qualcomm Snapdragon 870 vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 870 Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.3318 TFLOPS )

Larger memory bandwidth (44GB/s vs 29.8GB/s)

Higher Frequency (3200MHz vs 2360MHz)

More modern manufacturing process (7nm vs 10nm)

Lower TDP (6W vs 9W)

Released 3 years and 4 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 870 +127%

810488

HiSilicon Kirin 970

355946

Geekbench 6 Single Core

Qualcomm Snapdragon 870 +198%

1151

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

Qualcomm Snapdragon 870 +142%

3336

HiSilicon Kirin 970

1377

FP32 (float)

Qualcomm Snapdragon 870 +314%

1372

HiSilicon Kirin 970

331

Qualcomm Snapdragon 870

VS

HiSilicon Kirin 970

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

3200 MHz

Frequency

2360 MHz

8

Cores

8

ARMv8.2-A

Instruction set

ARMv8-A

1 MB

L2 cache

2 MB

0

L3 cache

0

7 nm

Process

10 nm

10.3

Transistor count

5.5

6 W

TDP

9 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 650

GPU name

Mali-G72 MP12

670 MHz

GPU frequency

768 MHz

2

Execution units

12

512

Shading units

18

16

Max size

8

1.3721 TFLOPS

FLOPS

0.3318 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

2750 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

4x 16 Bit

44 Gbit/s

Max bandwidth

29.8 Gbit/s

Multimedia (ISP)

Hexagon 698

Neural processor (NPU)

Yes

UFS 3.0, UFS 3.1

Storage type

UFS 2.1

3840 x 2160

Max display resolution

3120 x 1440

1x 200MP, 2x 25MP

Max camera resolution

1x 48MP, 2x 20MP

8K at 30FPS, 4K at 60FPS

Video capture

4K at 30FPS

8K at 30FPS, 4K at 60FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

32 bit@384 kHz, HD-audio

X55

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 18

Yes

5G support

No

Up to 7500 Mbps

Download speed

Up to 1200 Mbps

Up to 3000 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Jan 2021

Announced

Sep 2017

Flagship

Class

Flagship

SM8250-AC

Model number

Hi3670

Qualcomm Snapdragon 870

Official page

HiSilicon Kirin 970

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